Ultrathin Barrier Formation Using Combination of Manganese Oxide Encapsulation and Self-Aligned Copper Silicon Nitride Barriers for Copper Wiring in Future LSI Interconnects
Kudo, H., Haneda, M., Ohtsuka, N., Tabira, T., Sunayama, M., Ochimizu, H., Sakai, H., Owada, T., Kitada, H., Nara, Y.
Published in IEEE transactions on electron devices (01.10.2011)
Published in IEEE transactions on electron devices (01.10.2011)
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Journal Article
Restraint of Copper Oxidation Using Barrier Restoration Technique with Cu--Mn Alloy
Haneda, Masaki, Ohtsuka, Nobuyuki, Kudo, Hiroshi, Tabira, Takahiro, Sunayama, Michie, Shimizu, Noriyoshi, Ochimizu, Hirosato, Tsukune, Atsuhiro
Published in Japanese Journal of Applied Physics (01.05.2010)
Published in Japanese Journal of Applied Physics (01.05.2010)
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Journal Article
Semiconductor device and method for manufacturing the same
Shimizu Noriyoshi, Ohtsuka Nobuyuki, Sunayama Michie, Haneda Masaki, Tabira Takahiro, Nakao Yoshiyuki
Year of Publication 31.01.2017
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Year of Publication 31.01.2017
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