Measurement Process Optimization in Using Lock-in Thermography for Fault Localization of CoWos Packages
Chao, Shuanshe, Mei, Na, Lin, Xinyi, Sun, Tuo Bei, Yang, Dan, Ouyang, Keqing
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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