MIM capacitor integration for mixed-signal/RF applications
Ng, C.H., Ho, C.-S., Chu, S.-F.S., Sun, S.-C.
Published in IEEE transactions on electron devices (01.07.2005)
Published in IEEE transactions on electron devices (01.07.2005)
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Journal Article
Characterization of Tungsten Carbide as Diffusion Barrier for Cu Metallization
Wang, Shui Jinn, Tsai, Hao Yi, Sun, Shi Chung
Published in Japanese Journal of Applied Physics (01.04.2001)
Published in Japanese Journal of Applied Physics (01.04.2001)
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EFFECTS OF INTERFACIAL OXIDE LAYER FOR THE Ta2O5 CAPACITOR AFTER HIGH-TEMPERATURE ANNEALING
Lee, J S, Sun, S C, Chang, S J, Chen, J F, Liu, C H, Liaw, U H
Published in Jpn.J.Appl.Phys ,Part 1. Vol. 41, no. 2A, pp. 690-693. 2002 (01.02.2002)
Published in Jpn.J.Appl.Phys ,Part 1. Vol. 41, no. 2A, pp. 690-693. 2002 (01.02.2002)
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Foreword Special Issue on Integrated Circuits Technologies for RF Circuit Applications
Wang, A.Z.H., Zhao, B., Hutchby, J.A., Ostling, M., Sun, S.-C.
Published in IEEE transactions on electron devices (01.07.2005)
Published in IEEE transactions on electron devices (01.07.2005)
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Journal Article