Pattern Formation by Spinodal Decomposition in Ternary Lead-Free Sn-Ag-Cu Solder Alloy
Sun, Jia, Liang, Huaxin, Sun, Shaofu, Hu, Juntao, Teng, Chunyu, Zhao, Lingyan, Bai, Hailong
Published in Metals (Basel ) (01.10.2022)
Published in Metals (Basel ) (01.10.2022)
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Research on improving Liaoning Enterprise's self-innovation ability
Shaofu Sun
Published in 2013 6th International Conference on Information Management, Innovation Management and Industrial Engineering (01.11.2013)
Published in 2013 6th International Conference on Information Management, Innovation Management and Industrial Engineering (01.11.2013)
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Conference Proceeding
Phase structure of Cu3Sn/Cu and formation of monoclinic Cu grain at this interface during aging
Chen, Dongdong, Zhang, Xin, Lv, Jinmei, Qin, Junhu, Yi, Jianhong, Yan, Jikang, Li, Caiju, Leng, Congyan, Bai, Hailong, Sun, Shaofu, Lingyan zhao
Published in Intermetallics (01.11.2023)
Published in Intermetallics (01.11.2023)
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