Reliability of interfaces for lead-free solder bumps
Shih, R.L.H., Lau, D.Y.K., Kwok, R.W.M., Li, M., Sun, M.K.W.
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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