Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology
Wu, Xuefeng, Sun, Lingyao, Liu, Yingxia, Ye, Ziting, Zhao, Xiuchen, Liu, Ying
Published in Journal of materials research and technology (01.05.2023)
Published in Journal of materials research and technology (01.05.2023)
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Journal Article
A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
Sun, Lingyao, Guo, Zhenhua, Zhao, Xiuchen, Liu, Ying, Tu, Kingning, Liu, Yingxia
Published in Micromachines (Basel) (31.05.2022)
Published in Micromachines (Basel) (31.05.2022)
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Journal Article
Acupoint Detection Based on Deep Convolutional Neural Network
Sun, Lingyao, Sun, Shiying, Fu, Yuanbo, Zhao, Xiaoguang
Published in 2020 39th Chinese Control Conference (CCC) (01.07.2020)
Published in 2020 39th Chinese Control Conference (CCC) (01.07.2020)
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Conference Proceeding
The Mechanism of the Contact Resistance between Rail and Wheel in Bad Shunting Area
Jin, Kai Rui, Sun, Ling Yao, Huang, Zan Wu
Published in Applied Mechanics and Materials (29.11.2012)
Published in Applied Mechanics and Materials (29.11.2012)
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Journal Article
Hand Acupoint Detection from Images Based on Improved HRNet
Sun, Shiying, Xu, Hongduo, Sun, Lingyao, Fu, Yuanbo, Zhang, Yujia, Zhao, Xiaoguang
Published in 2022 International Joint Conference on Neural Networks (IJCNN) (18.07.2022)
Published in 2022 International Joint Conference on Neural Networks (IJCNN) (18.07.2022)
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Conference Proceeding
Comparative Study on the Effects of Fe and Ni Additions on the Electromigration Properties of Sn58Bi Solder Joints
Hou, Zhuangzhuang, Dong, Yaru, Sun, Lingyao, Liu, Ying, Huo, Yongiun, Liu, Yingxia, Zhao, Xiuchen
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
210^\mathrm reflow technology study in 3D Packaging
Sun, Lingyao, Dong, Yaru, Hou, Zhuangzhuang, Zhao, Xiuchen, Huo, Yongjun, Liu, Ying, Liu, Yingxia
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Alarm device and alarm method based on multiple sensors and electronic equipment
ZHAO BAOLI, GUO YULONG, FANG FENG, ZHAO YONG, LAN CHAO, PU FEI, TAN FEI, SUN LINGYAO, XU JUAN, LIAO QINGGANG, DIAO HAN, SU HAORAN
Year of Publication 10.10.2023
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Year of Publication 10.10.2023
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