Thermal Stability and Viscoelasticity Behavior of Underfill Encapsulants in Sustained High Temperature Environment up to 1-year
Lall, Pradeep, Zhang, Yunli, Suhling, Jeff
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Effect of Prolonged Storage on High strain rate Mechanical properties of QSAC10 and QSAC20 Solders after Exposure to Isothermal Aging of 50°C
Lall, Pradeep, Saha, Mrinmoy, Suhling, Jeff
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Characterization of Viscoelastic Behavior of Epoxy Molding Compounds Subjected to Sustained High Temperature Environment up to 1 year
Lall, Pradeep, Zhang, Yunli, Suhling, Jeff
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Effect of 100°C Aging for Periods of up to 120-days on High Strain Rate Properties of SAC305 Alloys
Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Blecker, Ken
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for QSAC10 and QSAC20
Lall, Pradeep, Saha, Mrinmoy, Suhling, Jeff
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Shock and Vibration Simulation for PBGA Board Assemblies with SAC Solder Interconnects using Non-Linear High Strain Rate Properties
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
Published in 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (30.05.2023)
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Conference Proceeding
Non-Perpendicular High-G Shock on Potted Fine Pitch Electronics Under Sustained High Temperature Aging
Lall, Pradeep, Ram, Aathi Raja, Suhling, Jeff, Deep, John
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
High Strain-Rate Properties for SAC305 at Cold Operating Temperatures down to -65°C
Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Blecker, Ken
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days
Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Blecker, Ken
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days
Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Blecker, Ken
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C
Lall, Pradeep, Saha, Mrinmoy, Suhling, Jeff, Blecker, Ken
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
High Strain Rate Materials Characterization at Low Test Temperatures for Thermally Aged SAC-Q Solder Alloys
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Effect of SAC105 Solder Alloys High Strain Rate Property Evolution on Plastic Work at Low Operating Temperatures
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Modeling Effect of Underfill Property Evolution on the FCBGA Reliability at Sustained Automotive Underhood Temperatures
Lall, Pradeep, Kasturi, Madhu, Wu, Haotian, Suhling, Jeff, Davis, Edward
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Low Temperature High Strain Rate Material Properties for SAC-Q Leadfree Alloys
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
Published in 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.07.2020)
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Conference Proceeding
Modeling of Effect of Underfill Properties on Flip Chip Bumps and Solder Balls of FCBGA Package in Automotive Underhood Applications
Lall, Pradeep, Kasturi, Madhu, Suhling, Jeff, Williamson, Jaimal
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures
Lall, Pradeep, Mehta, Vishal, Suhling, Jeff, Blecker, Ken
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Low Operating-Temperature High Strain Rate Constitutive Behavior of SnAgCu Solder Alloys after Prolonged Storage at High Temperature
Lall, Pradeep, Yadav, Vikas, Suhling, Jeff, Locker, David
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Evolution of Viscoelastic Properties of Underfills Exposed to High Temperature
Lall, Pradeep, Kasturi, Madhu, Wu, Haotian, Suhling, Jeff, Davis, Edward
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding