Process integration of CVD Cu seed using ALD Ru glue layer for sub-65nm Cu interconnect
Choi, S.-M., Park, K.-C., Suh, B.-S., Kim, I.-R., Kang, H.-K., Suh, K.-P., Park, H.-S., Ha, J.-S., Joo, D.-K.
Published in Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004 (2004)
Published in Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004 (2004)
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Conference Proceeding
Highly manufacturable Cu/low-k dual damascene process integration for 65nm technology node
Lee, K.-W., Shin, H.J., Hwang, J.W., Nam, S.W., Moon, Y.J., Wee, Y.J., Kim, I.G., Park, W.J., Kim, J.H., Lee, S.J., Park, K.K., Kang, H.-K., Suh, K.-P.
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) (2004)
Published in Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729) (2004)
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Conference Proceeding
Ultrathin gate oxide grown on nitrogen-implanted silicon for deep submicron CMOS transistors
Nam, In-Ho, Sim, Jae Sung, Hong, Sung In, Park, Byung-Gook, Lee, Jong Duk, Lee, Seung-Woo, Kang, Man-Sug, Kim, Young-Wug, Suh, Kwang-Pyuk, Lee, Won Seong
Published in IEEE transactions on electron devices (01.10.2001)
Published in IEEE transactions on electron devices (01.10.2001)
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Journal Article
Improved hot-carrier reliability of SOI transistors by deuterium passivation of defects at oxide/silicon interfaces
Kangguo Cheng, Jinju Lee, Karl, H., Lyding, J.W., Young-Kwang Kim, Young-Wug Kim, Kwang-Pyuk Suh
Published in IEEE transactions on electron devices (01.03.2002)
Published in IEEE transactions on electron devices (01.03.2002)
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Journal Article
A distributed scalable SiGe power device large signal model based on MEXTRAM 504
Yoon, S.-W., Laskar, J., Cho, D.H., Hong, K.S., Shin, H.J., Park, K.W., Yi, S.D., Suh, K.P., Park, B.H.
Published in 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers (2004)
Published in 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers (2004)
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Conference Proceeding
Pseudo-breakdown events induced by biased-thermal-stressing of intra-level Cu interconnects-reliability and performance impact
Song, W.S., Kim, T.J., Lee, D.H., Kim, T.K., Lee, C.S., Kim, J.W., Kim, S.Y., Jeong, D.K., Park, K.C., Wee, Y.J., Suh, B.S., Choi, S.M., Kang, H.-K., Suh, K.P., Kim, S.U.
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
Published in 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) (2002)
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Conference Proceeding
Glomus tumor of the trachea. Report of a case with ultrastructural observation
Kim, Yong Il, Kim, Joo Hyun, Suh, Jin‐Suk, Ham, Eui Keun, Suh, Kyung Pill
Published in Cancer (15.08.1989)
Published in Cancer (15.08.1989)
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Journal Article
Anatomically corrected malposition or the great arteries
Lee, Jeongryul, Kim, Yongjin, Yun, Yongsoo, Rho, Joonryang, Suh, Kyungphill
Published in The Annals of thoracic surgery (01.10.1991)
Published in The Annals of thoracic surgery (01.10.1991)
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Journal Article
Conference Proceeding
Highly manufacturable SONOS non-volatile memory for the embedded SoC solution
Kim, J.-H., Cho, I.W., Bae, G.J., Kim, S.S., Kim, K.C., Kim, S.H., Koh, K.W., Lee, N.I., Kang, H.-K., Suh, K.-P., Kang, S.T., Seo, M.K., Lee, S.H., Kim, M.C., Park, I.S.
Published in 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) (2003)
Published in 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407) (2003)
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Conference Proceeding
Highly stable partial body tied SOI CMOS technology with Cu interconnect and low-k dielectric for high performance microprocessor
Kim, Y. W., Oh, C. B., Kang, H. S., Oh, M. H., Yoo, S. H., Chung, M. K., Kim, B. S., Suh, K. P.
Published in 2002 IEEE International SOI Conference (2002)
Published in 2002 IEEE International SOI Conference (2002)
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Conference Proceeding
Advanced i-PVD barrier metal deposition technology for 90 nm Cu interconnects
Park, K.-C., Kim, I.-R., Suh, B.-S., Choi, S.-M., Song, W.-S., Wee, Y.-J., Lee, S.-G., Chung, J.-S., Chung, J.-H., Hah, S.-R., Ahn, J.-H., Lee, K.-T., Kang, H.-K., Suh, K.-P.
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
Published in Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) (2003)
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Conference Proceeding
Re-defining reliability assessment per new intra-via Cu leakage degradation
Song, W.S., Lee, C.S., Park, K.C., Suh, B.S., Kim, J.W., Kim, S.Y., Wee, Y.J., Choi, S.M., Kang, H.-K., Kim, S.U., Suh, K.P.
Published in 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) (2002)
Published in 2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303) (2002)
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Conference Proceeding
Manufacturable embedded CMOS 6T-SRAM technology with high-k gate dielectric device for system-on-chip applications
Oh, C.B., Kang, H.S., Ryu, H.J., Oh, M.H., Jung, H.S., Kim, Y.S., He, J.H., Lee, N.I., Cho, K.H., Lee, D.H., Yang, T.H., Cho, I.S., Kang, H.K., Kim, Y.W., Suh, K.P.
Published in Digest. International Electron Devices Meeting (2002)
Published in Digest. International Electron Devices Meeting (2002)
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Conference Proceeding
50nm gate length logic technology with 9-layer Cu interconnects for 90nm node SoC applications
Kim, Y.W., Oh, C.B., Ko, Y.G., Lee, K.T., Ahn, J.H., Park, T.S., Kang, H.S., Lee, D.H., Jung, M.K., Yu, H.J., Jung, K.S., Liu, S.H., Oh, B.J., Kim, K.S., Lee, N.I., Park, M.H., Bae, G.J., Lee, S.G., Song, W.S., Wee, Y.G., Jeon, C.H., Suh, K.P.
Published in Digest. International Electron Devices Meeting (2002)
Published in Digest. International Electron Devices Meeting (2002)
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Conference Proceeding
Application of high pressure deuterium annealing for improving the hot carrier reliability of CMOS transistors
Jinju Lee, Kangguo Cheng, Zhi Chen, Hess, K., Lyding, J.W., Young-Kwang Kim, Hyui-Seung Lee, Young-Wug Kim, Kwang-Pyuk Suh
Published in IEEE electron device letters (01.05.2000)
Published in IEEE electron device letters (01.05.2000)
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Journal Article