Prediction of mechanical properties on zinc system alloys and their application to high temperature lead-free solder
Zhefeng Xu, Matsugi, Kazuhiro, Yongbum Choi, Terada, Keigo, Suetsugu, Ken-ichiro
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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