Q factor damping of anti-resonance peak by variable on-die capacitance
Ichimura, Wataru, Kiyoshige, Sho, Terasaki, Masahiro, Otsuka, Hiroki, Sudo, Toshio
Published in 2014 International Symposium on Electromagnetic Compatibility (01.09.2014)
Published in 2014 International Symposium on Electromagnetic Compatibility (01.09.2014)
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Conference Proceeding
Effects of critically damped total PDN impedance in chip-package-board co-design
Kobayashi, R., Kubo, G., Otsuka, H., Mido, T., Kobayashi, Y., Fujii, H., Sudo, T.
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
Published in 2012 IEEE International Symposium on Electromagnetic Compatibility (01.08.2012)
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Conference Proceeding
Effects of On-Chip Decoupling Capacitor on Switching Noise and Radiated Emission
Sudo, Toshio, Nakano, Ken, Kudo, Junichi, Haga, Satoru
Published in Japanese Journal of Applied Physics (01.10.2003)
Published in Japanese Journal of Applied Physics (01.10.2003)
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Journal Article
Design and analysis for noise suppression of DC/DC converter
Terasaki, Masahiro, Oohashi, Yuta, Masuyama, You, Sudo, Toshio
Published in 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2014)
Published in 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS) (01.12.2014)
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Conference Proceeding
On-board snubber circuit for damping of anti-resonance peak in total PDN
Yamaguchi, Toma, Kurita, Kanae, Sudo, Toshio
Published in IEEE CPMT Symposium Japan 2014 (01.11.2014)
Published in IEEE CPMT Symposium Japan 2014 (01.11.2014)
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Conference Proceeding
GAUGE TERMINAL CONNECTION STRUCTURE
ANZAI KOTARO, OYANAGI MASAYUKI, SUDO TOSHIO, IDA YOSHITAKA, SOGA HARUNOBU
Year of Publication 28.10.2021
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Year of Publication 28.10.2021
Patent
GAUGE TERMINAL CONNECTION STRUCTURE
ANZAI KOTARO, OYANAGI MASAYUKI, SUDO TOSHIO, IDA YOSHITAKA, SOGA HARUNOBU
Year of Publication 28.10.2021
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Year of Publication 28.10.2021
Patent
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
Er-Ping Li, Xing-Chang Wei, Cangellaris, Andreas C, En-Xiao Liu, Yao-Jiang Zhang, D'Amore, Marcello, Joungho Kim, Sudo, Toshio
Published in IEEE Transactions on Electromagnetic Compatibility (01.05.2010)
Published in IEEE Transactions on Electromagnetic Compatibility (01.05.2010)
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Book Review
Journal Article
A study on broadband switching noise reduction by embedding high-density thin-film capacitor in a laminate package
Kaneko, S., Takahahsi, Y., Sudo, T., Kanno, A., Sugimmoto, A., Kuwako, F.
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
Published in 2008 Electrical Design of Advanced Packaging and Systems Symposium (01.12.2008)
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Conference Proceeding
Correlation of PDN impedance between measurements and simulation of 3D-SiP
Kawaguchi, Shohei, Sato, Masaomi, Takatani, Hiroki, Tanaka, Yosuke, Fujita, Haruya, Suto, Yoichi, Sudo, Toshio
Published in 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) (01.12.2013)
Published in 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium (EDAPS) (01.12.2013)
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Conference Proceeding
COMPUTER PROGRAM FOR DETERMINING WIRE CONNECTION STATE OF ELECTRONIC WATTHOUR METER
KANEDA YASUHIRO, KATAOKA HISAAKI, SUDO YASUKO, KUROSAWA WATARU, WATANABE NAOKI, ANZAI KOTARO, OYANAGI MASAYUKI, SUDO TOSHIO
Year of Publication 27.07.2020
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Year of Publication 27.07.2020
Patent