Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
Ma, Limin, Zuo, Yong, Liu, Sihan, Guo, Fu, Lee, Andre, Subramanian, K.N.
Published in Journal of alloys and compounds (05.02.2016)
Published in Journal of alloys and compounds (05.02.2016)
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Journal Article
Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
Guo, F., Choi, S., Subramanian, K.N., Bieler, T.R., Lucas, J.P., Achari, A., Paruchuri, M.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2003)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.06.2003)
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Journal Article
Strain patterns in three different femoral interlocking nail-bone units: A biomechanical comparative study
Maripuri, S.N, Subramanian, K.N, Debnath, U.K, Evans, S, Mohanty, K
Published in Injury extra (01.05.2008)
Published in Injury extra (01.05.2008)
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Journal Article
Mechanical characterization of Sn-3.5Ag solder joints at various temperatures
Rhee, H, Subramanian, K.N, Lee, A, Lee, J.G
Published in Soldering & surface mount technology (01.12.2003)
Published in Soldering & surface mount technology (01.12.2003)
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Journal Article
Effect of strain on whisker growth in matte tin
Southworth, A.R, Ho, C.E, Lee, A, Subramanian, K.N
Published in Soldering & surface mount technology (08.02.2008)
Published in Soldering & surface mount technology (08.02.2008)
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Journal Article
Intermetallic morphology around Ni particles in Sn-3.5Ag solder
Lee, J.G, Guo, F, Subramanian, K.N, Lucas, J.P
Published in Soldering & surface mount technology (01.08.2002)
Published in Soldering & surface mount technology (01.08.2002)
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Journal Article
Current concepts on management of cuff tear
Prabhakar, Akil, Kanthalu Subramanian, Jeash Narayan, Swathikaa, P., Kumareswaran, S.I., Subramanian, K.N.
Published in Journal of clinical orthopaedics and trauma (01.05.2022)
Published in Journal of clinical orthopaedics and trauma (01.05.2022)
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Journal Article
Effects of Pb contamination on the eutectic Sn-Ag solder joint
Choi, S, Bieler, T.R, Subramanian, K.N, Lucas, J.P
Published in Soldering & surface mount technology (01.01.2001)
Published in Soldering & surface mount technology (01.01.2001)
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Journal Article
Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock
Guo, F., Lee, J.G., Hogan, T., Subramanian, K.N.
Published in Journal of materials research (01.02.2005)
Published in Journal of materials research (01.02.2005)
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Journal Article