The use of surfactants and post supercritical CO2 mixing on the electroless nickel metallization of blind holes in printed circuit board
Jun-Wei Su, Chen-Hsin Yao, Chun-Ying Lee, Wun-Jheng Zeng, Chen-Shan Peng, Su-Chiou Chen
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
Published in 2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2017)
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