Flipchip bump integrity with copper/ultra low-k dielectrics for fine pitch flipchip packaging
Seung Wook Yoon, Kripesh, V., Li Hong Yu, Li Chao Yong, Su Yong Ji Jeffrey, Iyer, M.K.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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