Outcomes of transurethral removal of intravesical or intraurethral mesh following midurethral sling surgery
Jo, Dae-Jin, Lee, Young-Suk, Oh, Tae-Hee, Ryu, Dong-Su, Kwak, Kyung-Won
Published in Korean journal of urology (01.12.2011)
Published in Korean journal of urology (01.12.2011)
Get full text
Journal Article
Metal Thermal Interface Material for the Next Generation FCBGA
Kim, YunAh, Bae, JoHyun, Jung, HyunHye, Choi, MiKyoung, Kweon, YoungDo, Ryu, DongSu, Park, DongJoo, Khim, JinYong
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding
Next Gen Laser Assisted Bonding (LAB) Technology
Na, SeokHo, Gim, MinHo, Kim, ChoongHoe, Park, DongHyeon, Ryu, DongSu, Park, DongJoo, Khim, JinYoung
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
BAE, Jo Hyun, SIEW, Glen, RYU, Dong Su, KONG, Min Jae, YOSHIDA, Akito
Year of Publication 04.01.2024
Get full text
Year of Publication 04.01.2024
Patent
High Reliability Power Package Design for Automotive Requirements
Kim, Byong Jin, Su Ryu, Dong, Ting, Jia Yunn, Jeon, HyeongIl, Chim, Weng Tuck, Whitchurch, Nathan
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Get full text
Conference Proceeding
High-Performance Flip Chip Bonding Mechanism Study with Laser Assisted Bonding
Gim, MinHo, Kim, ChoongHoe, Na, SeokHo, Ryu, DongSu, Park, KyungRok, Kim, JinYoung
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Get full text
Conference Proceeding
LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS
Kim, Choong Hoe, Park, Dong Hyeon, Song, Yun Seok, Ryu, Dong Su, Park, Dong Joo, Kim, Min Ho, Na, Seok Ho, Ju, Woo Kyung
Year of Publication 21.12.2023
Get full text
Year of Publication 21.12.2023
Patent
Pb-Free, High Thermal and Electrical Performance Driven Die Attach Material Development for Power Packages
Kim, Byong Jin, Ryu, Dong Su, Jeon, HyeongIl, Hazellah, Muhammad Hadhari, Chim, Weng Tuck, Khim, Jin Young
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Get full text
Conference Proceeding
Hybrid bonding interconnection using laser and thermal compression
Kim, Choong Hoe, Park, Dong Hyeon, Song, Yun Seok, Ryu, Dong Su, Kim, Min Ho, Na, Seok Ho, Ju, Woo Kyung
Year of Publication 05.09.2023
Get full text
Year of Publication 05.09.2023
Patent
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Park, Dong Hyeon, Khim, Jin Young, Bae, Jo Hyun, Kong, Min Jae, Ryu, Dong Su, Kim, Yun Ah, Na, Seok Ho, Kang, Dong Hee, Bae, Jae Yeong, Choi, Won Ho
Year of Publication 16.05.2024
Get full text
Year of Publication 16.05.2024
Patent
LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS
Kim, Choong Hoe, Park, Dong Hyeon, Song, Yun Seok, Ryu, Dong Su, Park, Dong Joo, Kim, Min Ho, Na, Seok Ho, Ju, Woo Kyung
Year of Publication 23.03.2023
Get full text
Year of Publication 23.03.2023
Patent
LASER BONDED DEVICES, LASER BONDING TOOLS, AND RELATED METHODS
Kim, Choong Hoe, Park, Dong Hyeon, Song, Yun Seok, Ryu, Dong Su, Kim, Min Ho, Na, Seok Ho, Ju, Woo Kyung
Year of Publication 23.12.2021
Get full text
Year of Publication 23.12.2021
Patent
HYBRID BONDING INTERCONNECTION USING LASER AND THERMAL COMPRESSION
Kim, Choong Hoe, Park, Dong Hyeon, Song, Yun Seok, Ryu, Dong Su, Kim, Min Ho, Na, Seok Ho, Ju, Woo Kyung
Year of Publication 23.12.2021
Get full text
Year of Publication 23.12.2021
Patent
Electronic devices and methods of manufacturing electronic devices
SIEW, GLEN, RYU, DONG-SU, YOSHIDA, AKITO, KONG, MIN-JAE, BAE, JO-HYUN
Year of Publication 01.01.2024
Get full text
Year of Publication 01.01.2024
Patent
Laser bonding apparatus, laser bonding tool, and related methods
KIM MIN-HO, NA SEOK-HO, ZHU YUKUN, PARK DONG HYUN, RYU DONG-SU, PARK DONG-KOO, SONG WOON SEOK, KIM JONG-HA
Year of Publication 31.05.2024
Get full text
Year of Publication 31.05.2024
Patent