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Published in Journal of electronic materials (01.10.2004)
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Conference Proceeding
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Zang, Zhi-Jun, Tang, Hong-Feng, Tuo, Ying, Xing, Wei-Jie, Ji, Su-Yun, Gao, Yong, Deng, Chun-Hua
Published in Asian journal of andrology (01.07.2016)
Published in Asian journal of andrology (01.07.2016)
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Journal Article
Flipchip bump integrity with copper/ultra low-k dielectrics for fine pitch flipchip packaging
Seung Wook Yoon, Kripesh, V., Li Hong Yu, Li Chao Yong, Su Yong Ji Jeffrey, Iyer, M.K.
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)
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Conference Proceeding
METHOD OF UPDATING SOFTWARE ON READ-ONLY FILE SYSTEM IN MOBILE TELEPHONE
KWON, JIN KYOUNG, JI, YONG SU, KIM, JUN GU, CHOI, JONG SAM, CHO, TAN WOONG, JANG, SANG KON
Year of Publication 31.12.2008
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Year of Publication 31.12.2008
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