Die bonding with Au/In isothermal solidification technique
WANG, T. B, SHEN, Z. Z, YE, R. Q, XIE, X. M, STUBHAN, F, FREYTAG, J
Published in Journal of electronic materials (01.04.2000)
Published in Journal of electronic materials (01.04.2000)
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The effect of PECVD SiNx moisture barrier layers on the degradation of a flip chip underfill material
Kaltenpoth, G, Siebert, W, Xie, X-M, Stubhan, F
Published in Soldering & surface mount technology (01.01.2001)
Published in Soldering & surface mount technology (01.01.2001)
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A novel high performance die attach
Xie, X.M, Wang, T.B, Shi, J.Z, Ye, R.Q, Stubhan, F, Freytag, J
Published in Soldering & surface mount technology (01.01.2000)
Published in Soldering & surface mount technology (01.01.2000)
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Low temperature PECVD SiNx films applied in OLED packaging
Huang, Weidong, Wang, Xuhong, Sheng, Mei, Xu, Liqiang, Stubhan, Frank, Luo, Le, Feng, Tao, Wang, Xi, Zhang, Fumin, Zou, Shichang
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.04.2003)
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.04.2003)
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Mobile diagnosis [of vehicle mechatronic systems]
Luka, J., Stubhan, F.
Published in Proceedings of the IEEE International Vehicle Electronics Conference (IVEC'99) (Cat. No.99EX257) (1999)
Published in Proceedings of the IEEE International Vehicle Electronics Conference (IVEC'99) (Cat. No.99EX257) (1999)
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Conference Proceeding
Moisture barrier properties of plasma enhanced chemical vapor deposited SiCxNy films on polyethylene naphthalate sheets and epoxy molding compound
KALTENPOTH, Gisela, SIEBERT, Walter, STUBHAN, Frank, XUHONG WANG, LE LUO
Published in Surface & coatings technology (01.11.2002)
Published in Surface & coatings technology (01.11.2002)
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Journal Article
Moisture-resistant properties of SiNx films prepared by PECVD
Lin, Hui, Xu, Liqiang, Chen, Xiang, Wang, Xuhong, Sheng, Mei, Stubhan, Frank, Merkel, Karl-Heinz, Wilde, Juergen
Published in Thin solid films (01.11.1998)
Published in Thin solid films (01.11.1998)
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Journal Article
The effect of PECVD SiN x moisture barrier layers on the degradation of a flip chip underfill material
Kaltenpoth, G., Siebert, W., Xie, X‐M., Stubhan, F.
Published in Soldering & surface mount technology (01.12.2001)
Published in Soldering & surface mount technology (01.12.2001)
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Journal Article
The effect of PECVD SiN moisture barrier layers on the degradation of a flip chip underfill material
Kaltenpoth, G, Siebert, W, Xie, X-M, Stubhan, F
Published in Soldering & surface mount technology (01.12.2001)
Published in Soldering & surface mount technology (01.12.2001)
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Journal Article
The effect of PECVD SiN(x) moisture barrier layers on the degradation of a chip underfill material
Kaltenpoth, G, Siebert, W, Xie, X-M, Stubhan, F
Published in Soldering & surface mount technology (01.09.2001)
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Published in Soldering & surface mount technology (01.09.2001)
Journal Article
Effect of organic/inorganic coating on moisture diffusion in a chip-on-board package with globtop
WEIDONG HUANG, XUHONG WANG, LI WANG, MEI SHENG, LIQIANG XU, STUBHAN, Frank, LE LUO
Published in Journal of electronic materials (01.02.2004)
Published in Journal of electronic materials (01.02.2004)
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Journal Article
Moisture-resistant properties of SiN sub(x) films prepared by PECVD
Lin, H, Xu, L, Chen, X, Wang, X, Sheng, M, Stubhan, F, Merkel, K-H, Wilde, J
Published in Thin solid films (23.11.1998)
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Published in Thin solid films (23.11.1998)
Journal Article
Moisture-resistant properties of SiNx films prepared bv PECVD
HUI LIN, LIQIANG XU, XIANG CHEN, XUHONG WANG, MEI SHENG, STUBHAN, F, MERKEL, K.-H, WILDE, J
Published in Thin solid films (1998)
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Published in Thin solid films (1998)
Journal Article