Thermoelectric Properties of High-Doped Silicon from Room Temperature to 900 K
Stranz, A., Kähler, J., Waag, A., Peiner, E.
Published in Journal of electronic materials (01.07.2013)
Published in Journal of electronic materials (01.07.2013)
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Journal Article
Conference Proceeding
Measurements of thermoelectric properties of silicon pillars
Stranz, A., Sökmen, Ü., Kähler, J., Waag, A., Peiner, E.
Published in Sensors and actuators. A. Physical. (01.11.2011)
Published in Sensors and actuators. A. Physical. (01.11.2011)
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Journal Article
Improved micronanogenerators based on silicon compatible materials and processing
Donmez, I, Dolcet, M, Stranz, A, Salleras, M, Fonseca, L, Gadea, G, Pacios, M, Morata, A, Tarancon, A
Published in Journal of physics. Conference series (01.11.2019)
Published in Journal of physics. Conference series (01.11.2019)
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Journal Article
Production of vertical nanowire resonators by cryogenic-ICP–DRIE
Merzsch, S., Steib, F., Wasisto, H. S., Stranz, A., Hinze, P., Weimann, T., Peiner, E., Waag, A.
Published in Microsystem technologies (01.04.2014)
Published in Microsystem technologies (01.04.2014)
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Journal Article
Conference Proceeding
Capabilities of ICP-RIE cryogenic dry etching of silicon: review of exemplary microstructures
Sökmen, Ü, Stranz, A, Fündling, S, Wehmann, H-H, Bandalo, V, Bora, A, Tornow, M, Waag, A, Peiner, E
Published in Journal of micromechanics and microengineering (01.10.2009)
Published in Journal of micromechanics and microengineering (01.10.2009)
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Journal Article
Shallow and deep dry etching of silicon using ICP cryogenic reactive ion etching process
Sökmen, Ü., Stranz, A., Fündling, S., Merzsch, S., Neumann, R., Wehmann, H.-H., Peiner, E., Waag, A.
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2010)
Published in Microsystem technologies : sensors, actuators, systems integration (01.05.2010)
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Journal Article
Nanowire silicon as a material for thermoelectric energy conversion
Stranz, A., Kähler, J., Merzsch, S., Waag, A., Peiner, E.
Published in Microsystem technologies (01.08.2012)
Published in Microsystem technologies (01.08.2012)
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Journal Article
Conference Proceeding
Fabrication, packaging, and characterization of p-SOI Wheatstone bridges for harsh environments
Kähler, J., Stranz, A., Doering, L., Merzsch, S., Heuck, N., Waag, A., Peiner, E.
Published in Microsystem technologies (01.08.2012)
Published in Microsystem technologies (01.08.2012)
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Journal Article
Conference Proceeding
Fabrication and Characterization of Nanopillars for Silicon-Based Thermoelectrics
Stranz, A., Sökmen, Ü., Wehmann, H.-H., Waag, A., Peiner, E.
Published in Journal of electronic materials (01.09.2010)
Published in Journal of electronic materials (01.09.2010)
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Journal Article
Conference Proceeding
The call-bell in residential care homes: Experiences of residents and staff
Stranz, Anneli, Tishelman, Carol, Westerlund, Bo, Nilsson, Felicia, Hilton, Rebecca, Goliath, Ida
Published in Journal of aging studies (01.09.2022)
Published in Journal of aging studies (01.09.2022)
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Journal Article
Sintering of Copper Particles for Die Attach
Kahler, J., Heuck, N., Wagner, A., Stranz, A., Peiner, E., Waag, A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2012)
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Journal Article
Towards an ecologically-sustainable forestry in the Atlantic Forest
Fonseca, Carlos R., Ganade, Gislene, Baldissera, Ronei, Becker, Carlos G., Boelter, Carlos R., Brescovit, Antonio D., Campos, Lucas M., Fleck, Tomás, Fonseca, Vanda S., Hartz, Sandra M., Joner, Fernando, Käffer, Marcia I., Leal-Zanchet, Ana M., Marcelli, Marcelo P., Mesquita, Alex S., Mondin, Cláudio A., Paz, Claudia P., Petry, Maria V., Piovensan, Fabio N., Putzke, Jair, Stranz, Anamaria, Vergara, Micheline, Vieira, Emerson M.
Published in Biological conservation (01.06.2009)
Published in Biological conservation (01.06.2009)
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Journal Article
Pick-and-Place Silver Sintering Die Attach of Small-Area Chips
Kahler, J., Heuck, N., Stranz, A., Waag, A., Peiner, E.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2012)
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Journal Article
Analysis and Modeling of Thermomechanically Improved Silver-Sintered Die-Attach Layers Modified by Additives
Heuck, N., Langer, A., Stranz, A., Palm, G., Sittig, R., Bakin, A., Waag, A.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.11.2011)
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Journal Article
Evaluation of resonating Si cantilevers sputter-deposited with AIN piezoelectric thin films for mass sensing applications
SÖKMEN, Ü, STRANZ, A, WAAG, A, ABABNEH, A, SEIDEL, H, SCHMID, U, PEINER, E
Published in Journal of micromechanics and microengineering (Print) (2010)
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Published in Journal of micromechanics and microengineering (Print) (2010)
Conference Proceeding
Sinter-attach of Peltier dice for cooling of deep-drilling electronics
Kahler, J., Stranz, A., Waag, A., Peiner, E., Jung, S., Kruspe, T.
Published in 2012 IEEE International Instrumentation and Measurement Technology Conference Proceedings (01.05.2012)
Published in 2012 IEEE International Instrumentation and Measurement Technology Conference Proceedings (01.05.2012)
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Conference Proceeding
A resonant cantilever sensor for monitoring airborne nanoparticles
Wasisto, H. S., Merzsch, S., Stranz, A., Waag, A., Kirsch, I., Uhde, E., Salthammer, T., Peiner, E.
Published in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2011)
Published in 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference (01.06.2011)
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Conference Proceeding
Sinter-attach of high-temperature sensors for deep-drilling monitoring
Kahler, J., Stranz, A., Peiner, E., Waag, A.
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
Published in 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2012)
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Conference Proceeding