Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress Buffers
Mavinkurve, A., Zaal, Jeroen, Liang, Yukai, Xu, Sean, Storez, Antoine, Guo, Yuan, Teng, Seng, Chopin, Sheila
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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