A Reduced Output Ringing CMOS Buffer
Bartolini, M., Pulici, P., Stoppino, P.P., Campardo, G., Vanalli, G.P.
Published in IEEE transactions on circuits and systems. II, Express briefs (01.02.2007)
Published in IEEE transactions on circuits and systems. II, Express briefs (01.02.2007)
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Journal Article
System in Package Feasibility Process : This procedure and software process aims at rapid time-to-market and the ability to make use of many different component combinations: 3-D Integration Technologies
PAOLO STOPPINO, Pier, CONCI, Armando, LESSIO, Tito, FERRARA, Davide
Published in Proceedings of the IEEE (2009)
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Published in Proceedings of the IEEE (2009)
Journal Article
System in Package Feasibility Process
Stoppino, Pier Paolo, Conci, Armando, Lessio, Tito, Ferrara, Davide
Published in Proceedings of the IEEE (01.01.2009)
Published in Proceedings of the IEEE (01.01.2009)
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Journal Article
Through via structure including a conductive portion and aligned solder portion
CAMPARDO GIOVANNI, PULICI PAOLO, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO, LOSAVIO ALDO
Year of Publication 06.01.2015
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Year of Publication 06.01.2015
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METHOD FOR FORMING BUMPS IN SUBSTRATES WITH THROUGH VIAS
CAMPARDO GIOVANNI, PULICI PAOLO, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO, LOSAVIO ALDO
Year of Publication 18.09.2014
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Year of Publication 18.09.2014
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Method for forming bumps in substrates with through vias
CAMPARDO GIOVANNI, PULICI PAOLO, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO, LOSAVIO ALDO
Year of Publication 24.06.2014
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Year of Publication 24.06.2014
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Output buffer
PULICI PAOLO, BARTOLINI MICHELE, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO
Year of Publication 28.09.2010
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Year of Publication 28.09.2010
Patent
Output buffer
Bartolini, Michele, Stoppino, Pier Paolo, Pulici, Paolo, Vanalli, Gian Pietro
Year of Publication 28.09.2010
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Year of Publication 28.09.2010
Patent
Output Buffer
PULICI PAOLO, BARTOLINI MICHELE, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO
Year of Publication 02.07.2009
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Year of Publication 02.07.2009
Patent
METODO PER LA FORMAZIONE DI BUMP IN SUBSTRATI CON THROUGH VIA
CAMPARDO GIOVANNI, PULICI PAOLO, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO, LOSAVIO ALDO
Year of Publication 01.12.2011
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Year of Publication 01.12.2011
Patent
Output buffer
Bartolini, Michele, Stoppino, Pier Paolo, Pulici, Paolo, Vanalli, Gian Pietro
Year of Publication 09.12.2008
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Year of Publication 09.12.2008
Patent
Output buffer
PULICI PAOLO, BARTOLINI MICHELE, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO
Year of Publication 09.12.2008
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Year of Publication 09.12.2008
Patent
Output buffer
BARTOLINI, MICHELE, STOPPINO, PIER PAOLO, VANALLI, GIAN PIETRO, PULICI, PAOLO
Year of Publication 27.06.2007
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Year of Publication 27.06.2007
Patent
Inductive structure
RIPAMONTI, GIANCARLO, VANALLI, GIAN PIETRO, STOPPINO, PIER PAOLO, LESSIO, TITO, PULICI, PAOLO
Year of Publication 17.03.2010
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Year of Publication 17.03.2010
Patent
METODO PER LA FORMAZIONE DI BUMP IN SUBSTRATI CON THROUGH VIA
CAMPARDO GIOVANNI, PULICI PAOLO, VANALLI GIAN PIETRO, STOPPINO PIER PAOLO, LOSAVIO ALDO
Year of Publication 09.02.2010
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Year of Publication 09.02.2010
Patent
Integrated electronic device having a low voltage electric supply
Campardo, Giovanni, Vanalli, Gian Pietro, Stoppino, Pier Paolo, Dossi, Roberto, Losavio, Aldo
Year of Publication 10.11.2009
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Year of Publication 10.11.2009
Patent