Integration of multi physics modeling of 3D stacks into modern 3D data structures
Schneider, P, Heinig, A, Fischbach, R, Lienig, J, Reitz, S, Stolle, Jörn, Wilde, A
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
Published in 2010 IEEE International 3D Systems Integration Conference (3DIC) (01.11.2010)
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Conference Proceeding
Modular modeling approach to consider RF and thermal behavior of complex systems built up using interconnect structures in 3D integration
Reitz, S, Stolle, J, Martin, R, Wilde, A, Schneider, P
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)
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Conference Proceeding
A flow for parasitics extraction in 3D-systems
Heinig, A., Dittrich, M., Reitz, S., Stolle, J.
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
Published in 2012 International Semiconductor Conference Dresden-Grenoble (ISCDG) (01.09.2012)
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Conference Proceeding