Panel Level Packaging - From Idea to Industrialization
Braun, T., Becker, K.-F., Hoelck, O., Voges, S., Boettcher, L., Topper, M., Stobbe, L., Aschenbrenner, R., Voitel, M., Schneider-Ramelow, M., Lang, K.-D.
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
Published in 2019 IEEE CPMT Symposium Japan (ICSJ) (01.11.2019)
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Conference Proceeding
Transition to lead free soldering - a great change for a better understanding of materials and processes and green electronics
Mueller, J., Griese, H., Schischke, K., Stobbe, L.
Published in Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC (2005)
Published in Proceedings of 2005 International Conference on Asian Green Electronics, 2005. AGEC (2005)
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Conference Proceeding
Sustainable development of microelectronic technology processes integration of ecodesign
Griese, H., Schischke, K., Reichl, H., Stobbe, L.
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)
Published in Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) (2004)
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Conference Proceeding
Energy saving potential of converged ICT and CE
Schlomann, B., Stobbe, L., Nissen, N. F.
Published in 2012 IEEE International Conference on Consumer Electronics (ICCE) (01.01.2012)
Published in 2012 IEEE International Conference on Consumer Electronics (ICCE) (01.01.2012)
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Conference Proceeding
Non-energy related policy options to foster eco-design of electronics products
Maxwell, D., McAndrew, L., Schischke, K., Stobbe, L., Nissen, N. F., White, O.
Published in 2011 IEEE International Conference on Consumer Electronics -Berlin (ICCE-Berlin) (01.09.2011)
Published in 2011 IEEE International Conference on Consumer Electronics -Berlin (ICCE-Berlin) (01.09.2011)
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Conference Proceeding
Panel Level Packaging - A View Along the Process Chain
Braun, Tanja, Becker, K-F, Hoelck, O., Kahle, R., Wohrmann, M., Boettcher, L., Topper, M., Stobbe, L., Zedel, H., Aschenbrenner, R., Voges, S., Schneider-Ramelow, M., Lang, K-D
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Where is the Sweet Spot for Panel Level Packaging?
Braun, T, Becker, K. -F., Hoelck, O., Voges, S., Woehrmann, M., Boettcher, L., Toepper, M., Stobbe, L., Aschenbrenner, R., Schneider-Ramelow, M., Lang, K. -D.
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
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Conference Proceeding
Metrics for energy efficiency assessment in data centers and server rooms
Schaeppi, B., Bogner, T., Schloesser, A., Stobbe, L., de Asuncao, M. D.
Published in 2012 Electronics Goes Green 2012 (01.09.2012)
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Published in 2012 Electronics Goes Green 2012 (01.09.2012)
Conference Proceeding
Eco-reliability as a new approach of multi-criteria optimisation
Middendorf, A., Nissen, N. F., Stobbe, L., Wittler, O., Lang, K-D
Published in 2012 Electronics Goes Green 2012 (01.09.2012)
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Published in 2012 Electronics Goes Green 2012 (01.09.2012)
Conference Proceeding