Effects of Sn grain structure on the electromigration of Sn–Ag solder joints
Wang, Yiwei, Lu, Kuan H., Gupta, Vikas, Stiborek, Leon, Shirley, Dwayne, Chae, Seung-Hyun, Im, Jay, Ho, Paul S.
Published in Journal of materials research (28.04.2012)
Published in Journal of materials research (28.04.2012)
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Journal Article
Effect of Sn grain structure on electromigration reliability of Pb-free solders
Yiwei Wang, Lu, K. H., Gupta, V., Stiborek, L., Shirley, D., Im, J., Ho, P. S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Modeling and Characterization of a Hermetic Ceramic Package and Its Performance Impact on a 1.5-7V Input, 3-A, Radiation-Hardened Ultra-Low Dropout (LDO) Regulator
Valle, Javier, Ming, Li, Murugan, Rajen, Holloway, Jeff, Stiborek, Leon
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding