by Lehmann, V, Stengl, R, Luigart, A
Published in Materials science & engineering. B, Solid-state materials for advanced technology (01.01.2000)

by Blank, O., Reisinger, H., Stengl, R., Gutsche, M., Wiest, F., Capodieci, V., Schulze, J., Eisele, I.
Published in Journal of applied physics (15.02.2005)

by Bock, J., Schafer, H., Aufinger, K., Stengl, R., Boguth, S., Schreiter, R., Rest, M., Knapp, H., Wurzer, M., Perndl, W., Bottner, T., Meister, T.F.
Published in Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting (2004)

by Stengl, R., Tan, T., Gösele, U.
Published in Japanese Journal of Applied Physics (01.10.1989)

by Schäfer, H., Böck, J., Stengl, R., Knapp, H., Aufinger, K., Wurzer, M., Boguth, S., Rest, M., Schreiter, R., Meister, T.F.
Published in Applied surface science (15.03.2004)

by Meister, Schafer, Aufinger, Stengl, Boguth, Schreiter, Rest, Knapp, Wurzer, Mitchell, Bottner, Bock
Published in 2003 Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting (IEEE Cat. No.03CH37440) (2003)

by STENGL, R, AHN, K.-Y, GÖSELE, U
Published in Japanese Journal of Applied Physics (01.12.1988)

by Wurzer, M., Meister, T.F., Schafer, I., Knapp, H., Bock, J., Stengl, R., Aufinger, K., Franosch, M., Rest, M., Moller, M., Rein, H.-M., Felder, A.
Published in 1997 IEEE International Solids-State Circuits Conference. Digest of Technical Papers (01.01.1997)

by LEHMANN, V, MITANI, K, STENGL, R, MII, T, GOSELE, U
Published in Japanese Journal of Applied Physics (01.12.1989)

by Stengl, R.
Published in IEEE transactions on electron devices (01.04.1987)

by AHN, K.-Y, STENGL, R, TAN, T. Y, GÖSELE, U, SMITH, P
Published in Journal of applied physics (15.01.1989)

by Stengl, R., Gosele, U., Fellinger, C., Beyer, M., Walesch, S.
Published in IEEE transactions on electron devices (01.03.1986)

by Stengl, R., Falck, E.
Published in IEEE transactions on electron devices (01.09.1991)

by Stoisiek, M., Oppermann, K.G., Stengl, R.
Published in IEEE transactions on electron devices (01.06.1992)

by Barteau, M.A., Feulner, P., Stengl, R., Broughton, J.Q., Menzel, D.
Published in Journal of catalysis (01.07.1985)

by STENGL, R, AHN, K.-Y, MII, T, YANG, W.-S, GOSELE, U
Published in Japanese Journal of Applied Physics (01.12.1989)

by Yang, W.-S., Ahn, K.-Y., Marioton, B. P. R., Stengl, R., Gösele, U.
Published in Japanese Journal of Applied Physics (01.05.1989)

by Bock, J., Schafer, H., Knapp, H., Aufinger, K., Wurzer, M., Boguth, S., Bottner, T., Stengl, R., Perndl, W., Meister, T.F.
Published in IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004 (2004)

by Bock, J., Schafer, H., Knapp, H., Zoschg, D., Aufinger, K., Wurzer, M., Boguth, S., Rest, M., Schreiter, R., Stengl, R., Meister, T.F.
Published in Digest. International Electron Devices Meeting (2002)

by Meister, T.F., Knapp, H., Schafer, H., Aufinger, K., Stengl, R., Boguth, S., Schreiter, R., Rest, M., Perndl, W., Wurzer, M., Bottner, T., Bock, J.
Published in Digest of Papers. 2004 Topical Meeting onSilicon Monolithic Integrated Circuits in RF Systems, 2004 (2004)