Residual stresses in microelectronics induced by thermoset packaging materials during cure
Meuwissen, Marcel H.H., de Boer, Hedzer A., Steijvers, Henk L.A.H., Schreurs, Piet J.G., Geers, Marc G.D.
Published in Microelectronics and reliability (01.12.2004)
Published in Microelectronics and reliability (01.12.2004)
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