by Mendis, S.K., Kemeny, S.E., Gee, R.C., Pain, B., Staller, C.O., Quiesup Kim, Fossum, E.R.
Published in IEEE journal of solid-state circuits (01.02.1997)

by Yadid-Pecht, O., Pain, B., Staller, C., Clark, C., Fossum, E.
Published in IEEE journal of solid-state circuits (01.02.1997)

by Nixon, R H, Kemeny, S E, Pain, B, Staller, C O, Fossum, E R
Published in IEEE journal of solid-state circuits (01.12.1996)

by D’Souza, A. I., Dawson, L. C., Staller, C., Wijewarnasuriya, P. S., Dewames, R. E., Mclevige, W. V., Arias, J. M., Edwall, D., Hildebrandt, G.
Published in Journal of electronic materials (01.06.2000)

by Bunker, Shana, Staller, Christelle, Willenbacher, Norbert, Wool, Richard
Published in International journal of adhesion and adhesives (2003)

by Nixon, R.H., Kemeny, S.E., Pain, B., Staller, C.O., Fossum, E.R.
Published in IEEE journal of solid-state circuits (01.12.1996)

by D'Souza, A I, Dawson, L C, Staller, C, Wijewarnasuriya, P S
Published in Journal of electronic materials (01.06.2000)

by D'Souza, A I, Dawson, L C, Staller, C, Wijewarnasuriya, P S, Dewames, R E, McLevige, W V, Arias, J M, Edwall, D, Hildebrandt, G
Published in Journal of electronic materials (01.01.2000)

by Panicacci, R.A., Kemeny, S.E., Jones, P.D., Staller, C., Fossum, E.R.
Published in 1996 IEEE International Solid-State Circuits Conference. Digest of TEchnical Papers, ISSCC (1996)

by SCHRADI, Stefan - c/o Continental Automotive GmbH, GOLDSCHMIDT, Florian - c/o Continental Automotive GmbH, STALLER, Tobias - c/o Continental Automotive GmbH
Year of Publication 18.06.2020