MultOpt++: a fast regression-based model for the development of compositions with high robustness against scatter of element concentrations
Müller, Alexander, Roslyakova, Irina, Sprenger, Mario, Git, Paul, Rettig, Ralf, Markl, Matthias, Körner, Carolin, Singer, Robert F
Published in Modelling and simulation in materials science and engineering (02.01.2019)
Published in Modelling and simulation in materials science and engineering (02.01.2019)
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Journal Article
MultOpt++: a fast regression-based model for the constraint violation fraction due to composition uncertainties
Müller, Alexander, Sprenger, Mario, Ritter, Nils C, Rettig, Ralf, Markl, Matthias, Körner, Carolin, Singer, Robert F
Published in Modelling and simulation in materials science and engineering (02.01.2019)
Published in Modelling and simulation in materials science and engineering (02.01.2019)
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Journal Article
Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates
Hecht, Christoph, Sprenger, Mario, Franke, Jorg
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)
Published in 2024 47th International Spring Seminar on Electronics Technology (ISSE) (15.05.2024)
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Conference Proceeding
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
Utsch, Daniel, Hausler, Felix, Sprenger, Mario, Zirn, Julian, Franke, Jorg
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
Published in 2023 15th International Congress Mechatronic Integration Discourse (MID) (21.06.2023)
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Conference Proceeding
Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles
Forndran, Freerik, Sprenger, Mario, Barrera, Juan Ricardo, Steinau, Martin, Roellig, Mike, Muench, Stefan
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
Published in 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (07.04.2024)
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Conference Proceeding
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Hecht, Christoph, Schadow, Eric, Sprenger, Mario, Haussler, Felix, Stoll, Thomas, Franke, Jorg
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
Published in 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) (11.09.2023)
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Conference Proceeding
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
Sprenger, Mario, Noll, Niklas, Hecht, Christoph, de Greiff, Malte, Muller, Lars, Franke, Jorg
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Influence of Current Density on Wire Bond Lifetime in Active Power Cycling Test
Sippel, Marcel, Schmidt, Ralf, Kasbauer, Michael, Sprenger, Mario, Hensel, Alexander, Franke, Jorg
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
Sippel, Marcel, Hassel, Simon, Schmidt, Ralf, Sprenger, Mario, Hecht, Christoph, Franke, Jorg
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding
Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds
Sippel, Marcel, Tan, Yi Fong, Schmidt, Ralf, Botazzoli, Pietro, Sprenger, Mario, Franke, Jorg
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
Published in 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (17.04.2023)
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Conference Proceeding
Reliability of lead-free solders for die attach in automotive power modules
Ottinger, Bettina, Holverscheid, Joshua, Konig, Sebastian, Jerichow, Edgar, Lunz, Sebastian, Sprenger, Mario, Muller, Lars, Goth, Christian, Franke, Jorg
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)
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Conference Proceeding
Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
Hecht, Christoph, Slama, Jan-Niklas, Sprenger, Mario, HauBler, Felix, Sippel, Marcel, Franke, Jorg
Published in 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME) (26.10.2022)
Published in 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME) (26.10.2022)
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Conference Proceeding
High Temperature Die Attach: Study and Power Cycling of Direct-Bonded Silver Joints
Haubler, Felix, Sippel, Marcel, Sprenger, Mario, Liu, Lu, Muckelbauer, Martin, Franke, Jorg
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
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Conference Proceeding