Fabrication, Assembly, and Characterization of Stacked Multichip Modules Using Hot Pressed, Co-Fired Aluminum Nitride
Minehan, W.T., Weidner, W.K., Jensen, R.J., Spielberger, R.K., Jacobsen, W.F., Speerschneider, C.J.
Published in Proceedings of the International Conference on Multichip Modules (1994)
Published in Proceedings of the International Conference on Multichip Modules (1994)
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