Low Temperature Thermal Atomic Layer Deposition of Aluminum Nitride Using Hydrazine as the Nitrogen Source
Jung, Yong Chan, Hwang, Su Min, Le, Dan N., Kondusamy, Aswin L. N., Mohan, Jaidah, Kim, Sang Woo, Kim, Jin Hyun, Lucero, Antonio T., Ravichandran, Arul, Kim, Harrison Sejoon, Kim, Si Joon, Choi, Rino, Ahn, Jinho, Alvarez, Daniel, Spiegelman, Jeff, Kim, Jiyoung
Published in Materials (31.07.2020)
Published in Materials (31.07.2020)
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Journal Article
Pulsed chemical vapor deposition for crystalline aluminum nitride thin films and buffer layers on silicon and silicon carbide
McLeod, Aaron J., Ueda, Scott T., Lee, Ping C., Spiegelman, Jeff, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Kummel, Andrew C.
Published in Thin solid films (01.03.2023)
Published in Thin solid films (01.03.2023)
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Journal Article
Atomic layer annealing with radio-frequency substrate bias for control of grain morphology in gallium nitride thin films
McLeod, Aaron J., Lee, Ping C., Ueda, Scott T., Devereaux, Zachary J., Winter, Charles H., Spiegelman, Jeff, Kanjolia, Ravindra, Moinpour, Mansour, Kummel, Andrew C.
Published in MRS bulletin (01.11.2023)
Published in MRS bulletin (01.11.2023)
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Journal Article
Experimental and theoretical determination of the role of ions in atomic layer annealing
Ueda, Scott T, McLeod, Aaron, Jo, Youhwan, Zhang, Zichen, Spiegelman, Jacob, Spiegelman, Jeff, Alvarez, Dan, Moser, Daniel, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Cho, Kyeongjae, Kummel, Andrew C
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (07.04.2022)
Published in Journal of materials chemistry. C, Materials for optical and electronic devices (07.04.2022)
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Journal Article
Vapor-phase Surface Cleaning of Electroplated Cu Films Using Anhydrous N2H4
Hwang, Su Min, Peña, Luis Fabián, Tan, Kui, Kim, Harrison Sejoon, Kondusamy, Aswin L. N., Qin, Zhiyang, Jung, Yong Chan, Veyan, Jean-Francois, Alvarez, Daniel, Spiegelman, Jeff, Kim, Jiyoung
Published in ECS transactions (03.07.2019)
Published in ECS transactions (03.07.2019)
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Journal Article
Vapor-phase Surface Cleaning of Electroplated Cu Films Using Anhydrous N 2 H 4
Hwang, Su Min, Peña, Luis Fabián, Tan, Kui, Kim, Harrison Sejoon, Kondusamy, Aswin L. N., Qin, Zhiyang, Jung, Yong Chan, Veyan, Jean-Francois, Alvarez, Daniel, Spiegelman, Jeff, Kim, Jiyoung
Published in ECS transactions (03.07.2019)
Published in ECS transactions (03.07.2019)
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Journal Article
New vaporization sources for H2O2 for pre-treatment/cleaning of ALD deposition surfaces
Alvarez, Dan, Heinlein, Ed, Holmes, Russell J., Arya, Bhuvnesh, Shon-Roy, Lita, Spiegelman, Jeff
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
Published in ASMC 2013 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2013)
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Conference Proceeding
Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding
Kuo, Cheng-Hsuan, Pal, Dipayan, Wang, Victor, Manley, Madison, Sahay, Rohan, Kanjolia, Ravindra, Moinpour, Mansour, Woodruff, Jacob, Muhannad, Bakir, Spiegelman, Jeff, Kummel, Andrew C.
Published in 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) (22.04.2024)
Published in 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) (22.04.2024)
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Conference Proceeding
(Invited) Deposition of Crystalline AlN on Si and SiC Using Atomic Layer Annealing and Pulsed ALD/CVD
Kummel, Andrew C, Ueda, Scott, McLeod, Aaron, Alvarez, Daniel, Spiegelman, Jeff, Woodruff, Jacob, Moinpour, Mansour, Kanjolia, Ravindra
Published in Meeting abstracts (Electrochemical Society) (19.10.2021)
Published in Meeting abstracts (Electrochemical Society) (19.10.2021)
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Journal Article
Cleaning and Passivation of Copper Surface Using N 2 H 4 , and Self-Assembled Monolayers for Area-Selective Atomic Layer Deposition (AS-ALD) Applications
Hwang, Su Min, Kim, Jin-Hyun, Kim, Sang Woo, Jung, Yong Chan, Veyan, Jean-Francois, Alvarez, Daniel, Spiegelman, Jeff, Choi, Rino, Ahn, Jinho, Kim, Jiyoung
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
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Journal Article
(Invited) Low Temperature Thermal ALD TiN x and TaN x Films from Anhydrous N 2 H 4
Wolf, Steven, Breeden, Michael, Kavrik, Mahmut, Park, Jun Hong, Alvarez, Daniel, Holmes, Russell, Spiegelman, Jeff, Kummel, Andrew C
Published in Meeting abstracts (Electrochemical Society) (23.07.2018)
Published in Meeting abstracts (Electrochemical Society) (23.07.2018)
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Journal Article
Vapor-phase Surface Cleaning of Electroplated Cu Films Using Anhydrous N 2 H 4
Hwang, Su Min, Peña, Luis Fabián, Tan, Kui, Kim, Harrison Sejoon, Kondusamy, Aswin L. N., Qin, Zhiyang, Jung, Yong Chan, Veyan, Jean-Francois, Alvarez, Daniel, Spiegelman, Jeff, Kim, Jiyoung
Published in Meeting abstracts (Electrochemical Society) (01.09.2019)
Published in Meeting abstracts (Electrochemical Society) (01.09.2019)
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Journal Article