Materials science. High-frequency chip connections
Spencer, Todd J, Osborn, Tyler, Kohl, Paul A
Published in Science (American Association for the Advancement of Science) (09.05.2008)
Published in Science (American Association for the Advancement of Science) (09.05.2008)
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Journal Article
Air-Gap Transmission Lines on Organic Substrates for Low-Loss Interconnects
Spencer, T.J., Joseph, P.J., Tae Hong Kim, Swaminathan, M., Kohl, P.A.
Published in IEEE transactions on microwave theory and techniques (01.09.2007)
Published in IEEE transactions on microwave theory and techniques (01.09.2007)
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Journal Article
High-Frequency Chip Connections
Spencer, Todd J., Osborn, Tyler, Kohl, Paul A.
Published in Science (American Association for the Advancement of Science) (09.05.2008)
Published in Science (American Association for the Advancement of Science) (09.05.2008)
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Journal Article
Air-gap transmission lines for multiprocessor interconnects on FR-4 and BT substrates
Spencer, T.J., Kohl, P.A.
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)
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Conference Proceeding
LOW-POWER AND LIGHTWEIGHT HIGH-RESOLUTION DISPLAY
KOESTER ROBERT D, FRANCHINO ERIC R, SPENCER TODD J, GEBBEN ROBERT A, YAKUPCAK TERRY L
Year of Publication 09.12.2010
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Year of Publication 09.12.2010
Patent
Air cavity low-loss signal lines on bt substrates for high frequency chip-to-chip communication
Spencer, T.J., Jikai Chen, Saha, R., Bashirullah, R., Kohl, P.A.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding