Fabrication and Performance of 300 mm Wafer Scale Silicon Microchannel Cooler
Colgan, Evan G., Schleupen, Kai, Mann, Phillip, Kuder, Robert, Nah, Jae-Woong, Sakuma, Katsuyuki, Alvarez, Victor, Turlapati, Lavanya, Wong, Danny, Lukashov, Stanislav, Cordes, Steve, Speidell, James
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
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Journal Article
Electron and hole mobility enhancement in strained SOI by wafer bonding
Lijuan Huang, Chu, J.O., Goma, S.A., D'Emic, C.P., Koester, S.J., Canaperi, D.F., Mooney, P.M., Cordes, S.A., Speidell, J.L., Anderson, R.M., Wong, H.-S.P.
Published in IEEE transactions on electron devices (01.09.2002)
Published in IEEE transactions on electron devices (01.09.2002)
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Journal Article
Atomic Beam Alignment of Liquid Crystals
Chaudhari, Praveen, Lacey, James A., Lien, Shui-Chih Alan, Speidell, James L.
Published in Japanese Journal of Applied Physics (1998)
Published in Japanese Journal of Applied Physics (1998)
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Journal Article
Method and apparatus of processor wafer bonding for wafer-scale integrated supercomputer
Nah, Jae-Woong, Kuder, II, Robert P, Speidell, James L, Webb, Bucknell C, Colgan, Evan
Year of Publication 16.05.2023
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Year of Publication 16.05.2023
Patent
Packaging of high density fiber/laser modules using passive alignment techniques
Cohen, M.S., Cina, M.F., Bassous, E., Opyrsko, M.M., Speidell, J.L., Canora, F.J., DeFranza, M.J.
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1992)
Published in IEEE transactions on components, hybrids, and manufacturing technology (01.12.1992)
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Journal Article
Method and Apparatus of Processor Wafer Bonding for Wafer-Scale Integrated Supercomputer
Nah, Jae-Woong, Kuder, II, Robert P, Speidell, James L, Webb, Bucknell C, Colgan, Evan
Year of Publication 11.11.2021
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Year of Publication 11.11.2021
Patent
Masks for laser ablation technology: New requirements and challenges
Speidell, J. L., Pulaski, D. P., Patel, R. S.
Published in IBM journal of research and development (01.01.1997)
Published in IBM journal of research and development (01.01.1997)
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Journal Article
Direct edge connection for multi-chip integrated circuits
GRUBER PETER A, KNICKERBOCKER JOHN U, GOMA SHERIF A, CORDES STEVEN A, SPEIDELL JAMES L, FARINELLI MATTHEW J
Year of Publication 08.10.2013
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Year of Publication 08.10.2013
Patent
Direct edge connection for multi-chip integrated circuits
GRUBER PETER A, KNICKERBOCKER JOHN U, GOMA SHERIF A, CORDES STEVEN A, SPEIDELL JAMES L, FARINELLI MATTHEW J
Year of Publication 07.08.2012
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Year of Publication 07.08.2012
Patent
Direct edge connection for multi-chip integrated circuits
Cordes, Steven A, Farinelli, Matthew J, Goma, Sherif A, Gruber, Peter A, Knickerbocker, John U, Speidell, James L
Year of Publication 07.08.2012
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Year of Publication 07.08.2012
Patent
Direct Edge Connection for Multi-Chip Integrated Circuits
GRUBER PETER A, KNICKERBOCKER JOHN U, GOMA SHERIF A, CORDES STEVEN A, SPEIDELL JAMES L, FARINELLI MATTHEW J
Year of Publication 26.07.2012
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Year of Publication 26.07.2012
Patent
Fill head for injection molding of solder
GRUBER PETER A, KNICKERBOCKER JOHN U, CORDES STEVEN A, SPEIDELL JAMES L
Year of Publication 31.08.2010
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Year of Publication 31.08.2010
Patent
Rotational fill techniques for injection molding of solder
Cordes, Steven A, Gruber, Peter A, Knickerbocker, John U, Speidell, James L
Year of Publication 31.08.2010
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Year of Publication 31.08.2010
Patent
Fill head for injection molding of solder
Cordes, Steven A, Gruber, Peter A, Knickerbocker, John U, Speidell, James L
Year of Publication 31.08.2010
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Year of Publication 31.08.2010
Patent
Rotational fill techniques for injection molding of solder
GRUBER PETER A, KNICKERBOCKER JOHN U, CORDES STEVEN A, SPEIDELL JAMES L
Year of Publication 31.08.2010
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Year of Publication 31.08.2010
Patent
Universal mold for injection molding of solder
Cordes, Steven A, Gruber, Peter A, Knickerbocker, John U, Speidell, James L
Year of Publication 13.04.2010
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Year of Publication 13.04.2010
Patent
Universal mold for injection molding of solder
GRUBER PETER A, KNICKERBOCKER JOHN U, CORDES STEVEN A, SPEIDELL JAMES L
Year of Publication 13.04.2010
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Year of Publication 13.04.2010
Patent
Conductive bonding material fill techniques
GRUBER PETER A, KNICKERBOCKER JOHN U, CORDES STEVEN A, SPEIDELL JAMES L
Year of Publication 02.03.2010
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Year of Publication 02.03.2010
Patent