High performance interconnect
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Year of Publication 18.04.2017
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Year of Publication 18.04.2017
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High performance interconnect physical layer
SHARMA DEBENDRA DAS, JUE DARREN S, SWANSON JEFFREY C, BLANKENSHIP ROBERT G, IYER VENKATRAMAN, SPAGNA FULVIO
Year of Publication 29.08.2017
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Year of Publication 29.08.2017
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High performance interconnect physical layer
GUPTA ASHISH, JUE DARREN S, BLANKENSHIP ROBERT G, IYER VENKATRAMAN, SPAGNA FULVIO
Year of Publication 31.05.2017
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Year of Publication 31.05.2017
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A 90nm 1-4.25-Gb/s Multi Data Rate Receiver for High Speed Serial Links
Lidong Chen, Spagna, F., Marzolf, P., Wu, J.K.
Published in 2006 IEEE Asian Solid-State Circuits Conference (01.11.2006)
Published in 2006 IEEE Asian Solid-State Circuits Conference (01.11.2006)
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Conference Proceeding
HIGH PERFORMANCE INTERCONNECT
SAFRANEK ROBERT J, FAHIM BAHAA, DAS ABHISHEK, HUM HERBERT H, IYER SITARAMAN V, GUPTA ASHISH, JUE DARREN S, SPINK AARON T, SWANSON JEFFREY C, BLANKENSHIP ROBERT G, JOHNSON SIMON P, LIU YENNG, GEETHA VEDARAMAN, SPAGNA FULVIO, NALE BILL HARRY, SHAH RAHUL C, MADDOX ROBERT A, DAS SHARMA DEBENDRA, WILLEY JEFF, RAMANUJAN RAJ K, KUMAR ARVIND A, BEERS ROBERT, DHILLON YUVRAJ S, IYER VENKATRAMAN
Year of Publication 24.04.2014
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Year of Publication 24.04.2014
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Hochleistungsverdrahtungs-Bitübertragungsschicht
SWANSON, JEFFREY C, JUE, DARREN S, SPAGNA, FULVIO, DAS SHARMA, DEBENDRA, BLANKENSHIP, ROBERT G, IYER, VENKATRAMAN
Year of Publication 02.07.2015
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Year of Publication 02.07.2015
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Hochleistungsfähige physikalische Kopplungsstrukturschicht
JUE, DARREN S, GUPTA, ASHISH, SPAGNA, FULVIO, BLANKENSHIP, ROBERT G, IYER, VENKATRAMAN
Year of Publication 16.04.2015
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Year of Publication 16.04.2015
Patent