Flexible Hybrid Electronics Including Ultrathin Strain Sensors or Radio Frequency Identification Dies Manufactured on Wafer Silicon Carrier
Souriau, J-C., Poulain, C., Castagne, L., Ladner, C., Hilt, T., Franiatte, R., Mermin, D., David, N.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.07.2023)
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Journal Article
Effect of TSV density on local stress concentration: Micro-Raman spectroscopy measurement and Finite Element Analysis
Le Texier, F., Mazuir, J., Su, M., Castagné, L., Souriau, J.-C., Liotard, J.-L., Saadaoui, M., Inal, K.
Published in Microelectronic engineering (01.06.2013)
Published in Microelectronic engineering (01.06.2013)
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Journal Article
Conference Proceeding
Evaluation of Magnetoimpedance in Narrow NiFe/Al/NiFe Thin Films for Secured Packaging
Sohier, T., Michel, J. P., Borel, S., Souriau, J. C., Simon, G., Tria, A.
Published in IEEE transactions on magnetics (01.02.2022)
Published in IEEE transactions on magnetics (01.02.2022)
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Journal Article
A Novel Structure for Backside Protection Against Physical Attacks on Secure Chips or SiP
Borel, Stephan, Duperrex, L., Deschaseaux, E., Charbonnier, J., Clediere, J., Wacquez, R., Fournier, J., Souriau, J.-C, Simon, G., Merle, A.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Development of micro-system encapsulation for silicon devices which are in contact with human cells
Souriau, J.-C., Quiniou, C., Castagne, L., Simon, G.
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
Published in 2017 IEEE CPMT Symposium Japan (ICSJ) (01.11.2017)
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Conference Proceeding
A Versatile Platform towards High Reliability Compact Package for Digital Chips
Ferrandon, C., Castagne, L., Kholti, B., Waltener, G., Lemaire, R., Puyal, V., Souriau, J.-C, Simon, G., Lacrevaz, T., Peltier, J.-P, Toffanin, L.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
New trends in wafer level packaging
Sillon, N., Henry, D., Souriau, J.-C., Brun, J., Boutry, H., Cheramy, S.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
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Conference Proceeding
3D Printing as a New Packaging Approach for MEMS and Electronic Devices
Aspar, G., Goubault, B., Lebaigue, O., Souriau, J-C., Simon, G., Di Cioccio, L., Brechet, Y.
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Low electrical resistance silicon through vias: technology and characterization
Henry, D., Belhachemi, D., Souriau, J.-C., Brunet-Manquat, C., Puget, C., Ponthenier, G., Vallejo, J.L., Lecouvey, C., Sillon, N.
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process
Goubault, B., Aspar, G., Souriau, J.-C., Castagne, L., Simon, G., Di Cioccio, L., Brechet, Y.
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Spectroscopic properties and fluorescence dynamics of Er3+ and Yb3+ in CaYAlO4
SOURIAU, J. C, BOREL, C, WYON, C, LI, C, MONCORGE, R
Published in Journal of luminescence (01.07.1994)
Published in Journal of luminescence (01.07.1994)
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Journal Article
Optical properties and laser performance of some Yb3+, Er3+ and Tm3+-doped silicates
SOURIAU, J. C, ROMERO, R, BOREL, C, WYON, C, LI, C, MONCORGE, R
Published in Optical materials (01.12.1994)
Published in Optical materials (01.12.1994)
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Conference Proceeding
Journal Article
Assessment of advanced anisotropic conductive films for flip-chip interconnection based on Z axis conductors
Gasse, A., Rossat, C., Souriau, J.C., Gillot, C., Glasser, F., Clemens, J.C.
Published in 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515) (2003)
Published in 2003 IEEE Nuclear Science Symposium. Conference Record (IEEE Cat. No.03CH37515) (2003)
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Conference Proceeding