Spontaneous liver rupture in a patient with peliosis hepatis： A case report
Choi, Sun-Keun, Jin, Jun-Shuo, Cho, Soon-Gu, Choi, Suk-Jin, Kim, Chul-Soo, Choe, Yun-Mee, Lee, Keon-Young
Published in World journal of gastroenterology : WJG (21.11.2009)
Published in World journal of gastroenterology : WJG (21.11.2009)
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Journal Article
Studies on double-layered metal bumps for fine pitch flip chip applications
Ho-Young Son, Yong-Woon Yeo, Gi-Jo Jung, Jun-Kyu Lee, Joon-Young Choi, Chang-Joon Park, Min-Suk Suh, Soon-Jin Cho, Kyung-Wook Paik
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
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Conference Proceeding
The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
CHO, S.-J, PAIK, K.-W, KIM, Y.-G
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1997)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.05.1997)
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Journal Article
Flip chip assembly on PCB substrates with coined solder bumps
Jae-Woong Nah, Paik, K.W., Soon-Jin Cho, Won-Hoe Kim
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
A novel robust and low cost chips package and its thermal performance
Cho, Soon-Jin, Park, Sang-Wook, Park, Myung-Guen, Kim, Deok-Hoon
Published in IEEE transactions on advanced packaging (01.05.2000)
Published in IEEE transactions on advanced packaging (01.05.2000)
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Journal Article
The solder joint and runner metal reliability of wafer-level CSP (Omega-CSP)
In-Soo Kang, Jong-Heon Kim, Park, I.S., Ki-Rok Hur, Soon-Jin Cho, Hun Han, Jin Yu
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
Published in 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) (2000)
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Conference Proceeding