Search Results - "Soon Goo Lee" :: K.UTB vyhledávací portál

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CU ETCHING METHOD AND METHOD OF FABRICATING CHIP SCALE PACKAGE USING THE CU SPUTTERING METHOD

by JANG, YOUNG HOON, CHUNG, SEONG WOO, LEE, SOON GOO
Year of Publication 11.04.2007

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Patent

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METHOD FOR FORMING A CAPACITOR

by KIM, BOG SOO, CHUNG, SEONG WOO, LEE, SOON GOO
Year of Publication 06.12.2006

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Patent

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METHOD FOR ANISOTROPICALLY ETCHING SILICON

by CHUNG, BYUNG KUK, VORONIN, SERGEY, LEE, SOON GOO
Year of Publication 19.04.2005

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Patent

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Method of preparing a synthetic resinous article on which natural wood-based panels are formed

by LEE GOO-SOON, KIM SEUNG-JUN
Year of Publication 31.03.2010

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Patent

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Semiconductor package and method for fabricating the same

by Shin, Won Sun, Chun, Do Sung, Lee, Soon Goo, Shim, Il Kwon, DiCaprio, Vincent
Year of Publication 03.01.2006

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Patent

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Semiconductor package and method for fabricating the same

by SHIM IL KWON, DICAPRIO VINCENT, CHUN DO SUNG, LEE SOON GOO, SHIN WON SUN
Year of Publication 03.01.2006

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Patent

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Semiconductor package and method for fabricating the smae

by SHIM IL KWON, DICAPRIO VINCENT, CHUN DO SUNG, LEE SOON GOO, SHIN WON SUN
Year of Publication 15.01.2004

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Patent

CU ETCHING METHOD AND METHOD OF FABRICATING CHIP SCALE PACKAGE USING THE CU SPUTTERING METHOD

METHOD FOR FORMING A CAPACITOR

METHOD FOR ANISOTROPICALLY ETCHING SILICON

Method of preparing a synthetic resinous article on which natural wood-based panels are formed

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the smae

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