Thin Wafer Handling Challenges and Emerging Solutions
Farrens, Shari N., Bisson, Peter, Sood, Sumant, Hermanowski, James
Published in ECS transactions (23.11.2010)
Published in ECS transactions (23.11.2010)
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Journal Article
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding
Huyghebaert, Cedric, Van Olmen, Jan, Civale, Yann, Phommahaxay, Alain, Jourdain, Anne, Sood, Sumant, Farrens, Shari, Soussan, Philippe
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
Published in 2010 IEEE International Interconnect Technology Conference (01.06.2010)
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Conference Proceeding
Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging
Sood, Sumant, Farrens, Shari, Pinker, Ron, Xie, James, Cataby, Wilbur
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries
Sood, Sumant, Farrens, Shari, Rardin, Anthony, Kirk, Simon, Pettit, Dave
Published in ECS transactions (01.01.2010)
Published in ECS transactions (01.01.2010)
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Journal Article
Micro device metal joint process
Bibl, Andreas, Sood, Sumant, Kim, Hyeun-Su, Golda, Dariusz, Perkins, James M
Year of Publication 04.08.2020
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Year of Publication 04.08.2020
Patent
Novel Process Combining SOI and Strained Circuitry
Belfordab, R., Qing Xu, Sood, S., Acosta, A., Thrift, A., Zell, J., Bosworth, L.
Published in 2006 IEEE international SOI Conferencee Proceedings (01.10.2006)
Published in 2006 IEEE international SOI Conferencee Proceedings (01.10.2006)
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Conference Proceeding
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
Jie Gong, Sood, Sumant, Bhat, Rohit, Jahanbin, Sina, Aji, Prashant, Uhrmann, Thomas, Bravin, Julian, Burggraf, Jurgen, Wimplinger, Markus, Lindner, Paul
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding