2N Wire for Ultra Fine Pitch Wire Bonding: Challenges & Solutions
June Sub Hwang, Kumar, B.S., Jeong Tak Moon, Chul Uhm, Yu Na Kim, Sivakumar, M., Song Keng Yew, J.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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