Full-Chip Signal Integrity Analysis and Optimization of 3-D ICs
Song, Taigon, Liu, Chang, Peng, Yarui, Lim, Sung Kyu
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2016)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.05.2016)
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Journal Article
Design Methodologies for Low-Power 3-D ICs With Advanced Tier Partitioning
Jung, Moongon, Song, Taigon, Peng, Yarui, Lim, Sung Kyu
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2017)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2017)
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Journal Article
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
Kim, Joohee, Pak, Jun So, Cho, Jonghyun, Song, Eakhwan, Cho, Jeonghyeon, Kim, Heegon, Song, Taigon, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Yang, Seungtaek, Suh, Min-Suk, Byun, Kwang-Yoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Cho, Jonghyun, Song, Eakhwan, Yoon, Kihyun, Pak, Jun So, Kim, Joohee, Lee, Woojin, Song, Taigon, Kim, Kiyeong, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Yang, Seungtaek, Suh, Minsuk, Byun, Kwangyoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory)
Dae Hyun Kim, Athikulwongse, Krit, Healy, Michael B., Hossain, Mohammad M., Moongon Jung, Khorosh, Ilya, Kumar, Gokul, Young-Joon Lee, Lewis, Dean L., Tzu-Wei Lin, Chang Liu, Panth, Shreepad, Pathak, Mohit, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Loh, Gabriel H., Lee, Hsien-Hsin S., Sung Kyu Lim
Published in IEEE transactions on computers (01.01.2015)
Published in IEEE transactions on computers (01.01.2015)
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Journal Article
More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs
Taigon Song, Panth, Shreepad, Yoo-Jin Chae, Sung Kyu Lim
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.2016)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.12.2016)
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Journal Article
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
Liu, Chang, Song, Taigon, Cho, Jonghyun, Kim, Joohee, Kim, Joungho, Lim, Sung Kyu
Published in 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC) (05.06.2011)
Published in 2011 48th ACM/EDAC/IEEE Design Automation Conference (DAC) (05.06.2011)
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Conference Proceeding
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
Pak, Jun So, Kim, Joohee, Cho, Jonghyun, Kim, Kiyeong, Song, Taigon, Ahn, Seungyoung, Lee, Junho, Lee, Hyungdong, Park, Kunwoo, Kim, Joungho
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.02.2011)
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Journal Article
3D-MAPS: 3D Massively parallel processor with stacked memory
Dae Hyun Kim, Athikulwongse, K., Healy, M., Hossain, M., Moongon Jung, Khorosh, I., Kumar, G., Young-Joon Lee, Lewis, D., Tzu-Wei Lin, Chang Liu, Panth, S., Pathak, M., Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Loh, G., Hsien-Hsin Lee, Sung Kyu Lim
Published in 2012 IEEE International Solid-State Circuits Conference (01.02.2012)
Published in 2012 IEEE International Solid-State Circuits Conference (01.02.2012)
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Conference Proceeding
Transistor-level monolithic 3D standard cell layout optimization for full-chip static power integrity
Bon Woong Ku, Taigon Song, Nieuwoudt, Arthur, Sung Kyu Lim
Published in 2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) (01.07.2017)
Published in 2017 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED) (01.07.2017)
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Conference Proceeding
Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs
Song, Taigon, Liu, Chang, Peng, Yarui, Lim, Sung Kyu
Published in 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC) (29.05.2013)
Published in 2013 50th ACM/EDAC/IEEE Design Automation Conference (DAC) (29.05.2013)
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Conference Proceeding
On enhancing power benefits in 3D ICs: Block folding and bonding styles perspective
Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim
Published in 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC) (01.06.2014)
Published in 2014 51st ACM/EDAC/IEEE Design Automation Conference (DAC) (01.06.2014)
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Conference Proceeding
Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV)
Seungyoung Ahn, Junso Pak, Taigon Song, Heejae Lee, Jung-Gun Byun, Deogsoo Kang, Cheol-Seung Choi, Eunjung Kim, Jiyun Ryu, Mijoo Kim, Yumin Cha, Yangbae Chun, Chun-Taek Rim, Jae-Ha Yim, Dong-Ho Cho, Joungho Kim
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)
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Conference Proceeding