Continuous Patterning of Silver Nanowire-Polyvinylpyrrolidone Composite Transparent Conductive Film by a Roll-to-Roll Selective Calendering Process
Jeong, Hakyung, Lee, Jae Hak, Song, Jun-Yeob, Ghani, Faizan, Lee, Dongjin
Published in Nanomaterials (Basel, Switzerland) (21.12.2022)
Published in Nanomaterials (Basel, Switzerland) (21.12.2022)
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Journal Article
Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging
Kang, Sumin, Lee, Jae Hak, Kim, Seung Man, Lim, Jaeseung, Park, Ah‐Young, Han, Seongheum, Song, Jun‐Yeob, Kim, Seong‐Il
Published in Advanced materials technologies (10.03.2023)
Published in Advanced materials technologies (10.03.2023)
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Journal Article
Design of highly uniform spool and bar horns for ultrasonic bonding
Sun-Rak Kim, Jae Hak Lee, Yoo, C. D., Jun-Yeob Song, Lee, S. S.
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
Published in IEEE transactions on ultrasonics, ferroelectrics, and frequency control (01.10.2011)
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Journal Article
Finite Element Analysis for Safe Design of a Flexible Microelectronic System under Bending Deformation
Kim, Cha-Hee, Yun, Hyeonji, Seo, Seung-Ho, Kim, Byoung-Joon, Lee, Jae-Hak, Song, Jun-Yeob, Lee, Won-Jun
Published in ECS journal of solid state science and technology (01.04.2022)
Published in ECS journal of solid state science and technology (01.04.2022)
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Journal Article
UV-curing and thermal stability of dual curable urethane epoxy adhesives for temporary bonding in 3D multi-chip package process
Lee, Seung-Woo, Park, Ji-Won, Park, Cho-Hee, Lim, Dong-Hyuk, Kim, Hyun-Joong, Song, Jun-Yeob, Lee, Jae-Hak
Published in International journal of adhesion and adhesives (01.07.2013)
Published in International journal of adhesion and adhesives (01.07.2013)
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Journal Article
Failure mechanism of copper through-silicon vias under biased thermal stress
Seo, Seung-Ho, Hwang, Joo-Sun, Yang, Jun-Mo, Hwang, Wook-Jung, Song, Jun-Yeob, Lee, Won-Jun
Published in Thin solid films (01.11.2013)
Published in Thin solid films (01.11.2013)
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Journal Article
Conference Proceeding
Ubiquitous-Based Mobile Control and Monitoring of CNC Machines for Development of u-Machine
KIM, Dong-Hoon, SONG, Jun-Yeob
Published in Journal of mechanical science and technology (01.04.2006)
Published in Journal of mechanical science and technology (01.04.2006)
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Journal Article
Rheological properties and microstructures of Carbopol gel network system
KIM, Jong-Yun, SONG, Jun-Yeob, LEE, Eun-Joo, PARK, Seung-Kyu
Published in Colloid and polymer science (01.07.2003)
Published in Colloid and polymer science (01.07.2003)
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Journal Article
Open manufacturing system using MMS service and object oriented manufacturing equipments
KIM, Dong-Hoon, KIM, Sun-Ho, SONG, Jun-Yeob
Published in Journal of mechanical science and technology (01.12.2007)
Published in Journal of mechanical science and technology (01.12.2007)
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Journal Article
Design of pollution preventing system for camera window
Kim, Dong-Hoon, Song, Jun-Yeob, Cha, Suk-Keun, Lee, Moon-Rak
Published in Journal of mechanical science and technology (01.06.2008)
Published in Journal of mechanical science and technology (01.06.2008)
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Journal Article
Diagnosing the Cause of Operational Faults in Machine Tools with an Open Architecture CNC
DONG HOON KIM, SUN HO KIM, SONG, Jun-Yeob
Published in Journal of mechanical science and technology (01.08.2005)
Published in Journal of mechanical science and technology (01.08.2005)
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Journal Article
A new wafer level TSV build-up stacking using oxide bonding
Kim, Sun-Rak, Song, Jun-Yeob, Lee, Seung S, Lee, Jae Hak
Published in Journal of micromechanics and microengineering (01.06.2013)
Published in Journal of micromechanics and microengineering (01.06.2013)
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Journal Article
The effect of laser irradiation on peel strength of temporary adhesives for wafer bonding
Lee, Seung-Woo, Lee, Tae-Hyung, Park, Ji-Won, Park, Cho-Hee, Kim, Hyun-Joong, Kim, Seung-Man, Lee, Sung-Hun, Song, Jun-Yeob, Lee, Jae-Hak
Published in International journal of adhesion and adhesives (01.03.2015)
Published in International journal of adhesion and adhesives (01.03.2015)
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Journal Article
Curing Behaviors of UV-Curable Temporary Adhesives for a 3D Multichip Package Process
Lee, Seung-Woo, Lee, Tae-Hyung, Park, Ji-Won, Park, Cho-Hee, Kim, Hyun-Joong, Song, Jun-Yeob, Lee, Jae-Hak
Published in Journal of electronic materials (01.11.2014)
Published in Journal of electronic materials (01.11.2014)
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Journal Article
자율 최적 성형 공정 시스템 개발
박홍석, 송준엽, 김동훈, Park, Hong-Seok, Hoang, Van-Vinh, Song, Jun-Yeob, Kim, Dong-Hoon, Le, Ngoc-Tran
Published in 한국생산제조시스템학회지 (2013)
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Published in 한국생산제조시스템학회지 (2013)
Journal Article