Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
Lei Nie, Osterman, M., Fubin Song, Lo, J., Lee, S.W.R., Pecht, M.
Published in IEEE transactions on components and packaging technologies (01.12.2009)
Published in IEEE transactions on components and packaging technologies (01.12.2009)
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Journal Article
Iron-Catalyzed Oxidative α‑Amination of Ketones with Primary and Secondary Sulfonamides
Song, Fubin, Park, So Hyun, Wu, Christine, Strom, Alexandra E.
Published in Journal of organic chemistry (03.03.2023)
Published in Journal of organic chemistry (03.03.2023)
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Journal Article
A U-shaped-wound fiber macro-bending loss crack sensor improved by an optical splitter
Cheng, Lin, Song, Fubin, Zhang, Kai, Li, Yanlong, Yang, Jie
Published in Optical fiber technology (01.09.2020)
Published in Optical fiber technology (01.09.2020)
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Journal Article
Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish
Chaoran Yang, Fubin Song, Lee, S. W. R.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Brittle Failure Mechanism of SnAgCu and SnPb Solder Balls during High Speed Ball Shear and Cold Ball Pull Tests
Fubin Song, Lee, S.W.R., Newman, K., Sykes, B., Clark, S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
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Conference Proceeding
High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed
Fubin Song, Lee, S.W.R., Newman, K., Sykes, B., Clark, S.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.01.2007)
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Conference Proceeding
Development of innovative cold pin pull test method for solder pad crater evaluation
Qiming Zhang, Chaoran Yang, Mian Tao, Fubin Song, Lee, S. W. R.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Chaoran Yang, Fubin Song, Lee, S W Ricky, Newman, Keith
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Investigation of rework for straddle mount connectors
Li, J., Fubin Song, Khoo KoK Wei, Huang, J., Chen, A., Pu, Pk, Peng, S.
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
Published in 2012 14th International Conference on Electronic Materials and Packaging (EMAP) (01.12.2012)
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Conference Proceeding
Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis
Fubin Song, Newman, K., Chaoran Yang, Lee, S.W.R.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Assessment of non-uniform temperature effect on BGA de-component process
Kun Tang, Fubin Song, Lee, S. W. R., Lo, J. C. C.
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
Published in 2012 IEEE 62nd Electronic Components and Technology Conference (01.05.2012)
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Conference Proceeding
Effect of Thermal Aging on High Speed Ball Shear and Pull Tests of SnAgCu Lead-free Solder Balls
Fubin Song, Lee, S.W.R., Newman, K., Reynolds, H., Clark, S., Sykes, B.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding
Comparison of Joint Strength and Fracture Energy of Lead-free Solder Balls in High Speed Ball Shear/Pull Tests and their Correlation with Board Level Drop Test
Fubin Song, Lee, S.W.R., Newman, K., Clark, S., Sykes, B.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)
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Conference Proceeding