Power QFN Tiger device down bond bond-ability study
Hanmin Zhang, Hu, M., Yin, B. G., He, Q. C., Ye, D. H., Sonder Wang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Study of a practicable wire bonding method for applying copper wire bond to large-scale integrated circuits
Yingwei Jiang, RongLu Sun, Sonder Wang, Ding Min, Weimin Chen
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Effects of dispensed solder paste amount on solder void performance in a PQFN package
Youmin Yu, Yao, S.A., Sonder Wang, Weimin Chen, Jiang, Y.W.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Effects of reflow atmosphere on solder void and wire bond performances in a PQFN package
Youmin Yu, Yao, S.A., Lv, G.J., Wei Xiao, Sonder Wang, Jiang, Y.W., Chen, W.
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
Published in 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2008)
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Conference Proceeding
Low profile CSP BGA warpage improvement
Wang ZhiJie, Sonder Wang, Yao SuYing, Yin, B.G., Xu, Y.J., Leoni, M., Xiao Wei
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
A New Type Low Cost Sandwiched Power Package Structure and its Manufacturing
Ge, Garry, Lye, Gideon, Wang, Sonder, Zaal, Jeroen
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
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Conference Proceeding
A new structure & fabrication of a high dissipation 3D package with flexible substrate
Ge, Garry, Lye, Gideon, Wang, Sonder
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
A New Finding of Cu-Al IMC Corrosion and Investigation of Fluorine Contamination Influence on Cu-Al IMC Corrosion
Song, Meijiang, Mathew, Varughese, Li, Leo, Wang, Sonder, Han, M. C., Song, Yu, Descartin, Allen M.
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
Published in 2019 20th International Conference on Electronic Packaging Technology(ICEPT) (01.08.2019)
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Conference Proceeding
Power QFN down bond lift and delamination study
Hanmin Zhang, Hu, M., Wang, Sonder, Ilko, Schmadlak, Yin, B. G., He, Q. C., Ye, D. H.
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Error proof inkless die bonding process development
Wang ZhiJie, Sonder Wang, Wang, J.H., Yao SuYing, Han, R.
Published in 2005 7th Electronic Packaging Technology Conference (2005)
Published in 2005 7th Electronic Packaging Technology Conference (2005)
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Conference Proceeding
300mm low k wafer dicing saw study
Wang ZhiJie, Wang, S., Wang, J.H., Lee, S., Yao Su Ying, Han, R., Su, Y.Q.
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
Published in 2005 6th International Conference on Electronic Packaging Technology (2005)
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Conference Proceeding