A Comprehensive Study of Solder Joint Reliability Dependent on Temperature Cycling Profiles and Material Selections with Emphasis on an Improved Solder Fatigue Lifetime Model
Son, Bongchan, Chae, Seung-Hyun, Noh, Seungkwon, Lee, KilJae, Kim, Sangdeok
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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