Fusing Current Characterization of Various Cu RDL Designs in Wafer Level Packages
Ju, JeongMin, Whitchurch, Nathan, Yoon, JiYeon, Sohn, EunSook, Park, KyungRok
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Thermal Performance of an Indium-Silver Alloy Metal TIM for a Large Body Lidded FCBGA After EOL and Long-term Reliability Tests
Kim, SangHyuk, Sohn, EunSook, Kweon, YoungDo, Park, KyungRok
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Get full text
Conference Proceeding
Thermal Performance of Advanced TIMs for High-Power FCLBGAs
Koh, YoungJoon, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging
Kwon, JiHye, Ju, JeongMin, Kim, SangHyuk, Sohn, EunSook, Khim, JinYoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding
Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging
Jang, Heejun, Ahn, Kyun, Park, Haesung, Yong, Gamhan, Kim, Jihyun, Jeong, YeonKi, Sohn, EunSook, Hiner, Dave, Kelly, Mike, Hwang, Taekyeong, Do, Wonchul, Khim, JinYoung
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Get full text
Conference Proceeding
S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration
Lee, JiHun, Yong, GamHan, Jeong, MinSu, Jeon, JongHyun, Han, DongHoon, Lee, MinKeon, Do, WonChul, Sohn, EunSook, Kelly, Mike, Hiner, Dave, Khim, JinYoung
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Get full text
Conference Proceeding
Impact of package design and materials on reliability for temperature cycling, bend, and drop loading conditions
Syed, A., Scanlan, J., Se Woong Cha, Won Joon Kang, Eun Sook Sohn, Tae Seong Kim, Chang Gyun Ryu
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Get full text
Conference Proceeding