Numerical and experimental studies of ultra low profile three-dimensional heat sinks (3DHS) made using a novel manufacturing approach
Kota, K., Sobers, D., Kolodner, P., Bajaj, N., Jen-Hau Cheng, Simon, E., Salamon, T.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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