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Published in JOM (1989) (01.10.2018)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2017)
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2013)
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Published in IEEE transactions on industrial electronics (1982) (01.07.2013)
Published in IEEE transactions on industrial electronics (1982) (01.07.2013)
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Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias
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Published in IEEE transactions on microwave theory and techniques (01.12.2020)
Published in IEEE transactions on microwave theory and techniques (01.12.2020)
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Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling
Smet, V., Forest, F., Huselstein, J., Richardeau, F., Khatir, Z., Lefebvre, S., Berkani, M.
Published in IEEE transactions on industrial electronics (1982) (01.10.2011)
Published in IEEE transactions on industrial electronics (1982) (01.10.2011)
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Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures
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Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.01.2022)
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Anomalous evolution of topology in nanoporous copper under thermal and electrolyte treatment
Shahane, Ninad, Mohan, Kashyap, Smet, Vanessa, Antoniou, Antonia
Published in Materialia (01.05.2023)
Published in Materialia (01.05.2023)
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CYTOP for bonding highly oriented pyrolytic graphite to be used as heat spreader in mobile devices
Vaca, Diego, Smet, Vanessa, Joshi, Yogendra, Kumar, Satish
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
Published in 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (31.05.2022)
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Conference Proceeding
Heat Spreading and Heat Removal Needs of a Novel Power Electronics Package with Integrated Cooling
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Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Augmented finite element method (AFEM) for the linear steady-state thermal and thermomechanical analysis of heterogeneous integration architectures
Avula, Venkatesh, Smet, Vanessa, Joshi, Yogendra, Swaminathan, Madhavan
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
Published in 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (01.06.2021)
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Conference Proceeding
Enabling Chip-to-Substrate All-Cu Interconnections: Design of Engineered Bonding Interfaces for Improved Manufacturability and Low-Temperature Bonding
Shahane, Ninad, Mohan, Kashyap, Raj, P. M., Smet, Vanessa, Tummala, Rao, Antoniou, Antonia, Ramos, Gustavo, Taylor, Robin, Kilian, Arnd, Wei, Frank
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications
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Published in Journal of microelectronics and electronic packaging (01.07.2019)
Published in Journal of microelectronics and electronic packaging (01.07.2019)
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Modeling, design, fabrication and characterization of first large 2.5D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch
Sawyer, Brett, Hao Lu, Suzuki, Yuya, Takagi, Yutaka, Kobayashi, Makoto, Smet, Vanessa, Sakai, Taiji, Sundaram, Venky, Tummala, Rao
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications
Singh, Bhupender, Menezes, Gary, McCann, Scott, Jayaram, Vidya, Ray, Urmi, Sundaram, Venky, Pulugurtha, Raj, Smet, Vanessa, Tummala, Rao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2017)
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