Copper contact metallization for 22 nm and beyond
Soon-Cheon Seo, Chih-Chao Yang, Chun-Chen Yeh, Haran, B., Horak, D., Fan, S., Koburger, C., Canaperi, D., Papa Rao, S.S., Monsieur, F., Knorr, A., Kerber, A., Chao-Kun Hu, Kelly, J., Tuan Vo, Cummings, J., Smalleya, M., Petrillo, K., Mehta, S., Schmitz, S., Levin, T., Dae-Guy Park, Stathis, J.H., Spooner, T., Paruchuri, V., Wynne, J., Edelstein, D., McHerron, D., Doris, B.
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Published in 2009 IEEE International Interconnect Technology Conference (01.06.2009)
Get full text
Conference Proceeding