Influence of Si wafer thinning processes on (sub)surface defects
Inoue, Fumihiro, Jourdain, Anne, Peng, Lan, Phommahaxay, Alain, De Vos, Joeri, Rebibis, Kenneth June, Miller, Andy, Sleeckx, Erik, Beyne, Eric, Uedono, Akira
Published in Applied surface science (15.05.2017)
Published in Applied surface science (15.05.2017)
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Journal Article
Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding
Inoue, Fumihiro, Peng, Lan, Iacovo, Serena, Phommahaxay, Alain, Verdonck, Patrick, Meersschaut, Johan, Dara, Praveen, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric
Published in ECS journal of solid state science and technology (2019)
Published in ECS journal of solid state science and technology (2019)
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Journal Article
Edge trimming for surface activated dielectric bonded wafers
Inoue, Fumihiro, Jourdain, Anne, Visker, Jakob, Peng, Lan, Moeller, Berthold, Yokoyama, Kaori, Phommahaxay, Alain, Rebibis, Kenneth June, Miller, Andy, Beyne, Eric, Sleeckx, Erik
Published in Microelectronic engineering (05.01.2017)
Published in Microelectronic engineering (05.01.2017)
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Journal Article
Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material
Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Xiao Liu, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking
Inoue, Fumihiro, Jourdain, Anne, De Vos, Joeri, Sleeckx, Erik, Beyne, Eric, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Hopkins, Janet, Thomas, Dave, Uedono, Akira
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
Nagano, Fuya, Iacovo, Serena, Phommahaxay, Alain, Inoue, Fumihiro, Sleeckx, Erik, De Gendt, Stefan, Beyer, Gerald, Beyne, Eric
Published in ECS transactions (08.09.2020)
Published in ECS transactions (08.09.2020)
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Journal Article
Influence of Composition of SiCN Film for Surface Activated Bonding
Inoue, Fumihiro, Peng, Lan, Iacovo, Serena, Phommahaxay, Alain, Visker, Jakob, Verdonck, Patrick, Meersschaut, Johan, Dara, Praveen, Sleeckx, Erik, Miller, Andy, Beyne, Eric
Published in ECS transactions (20.07.2018)
Published in ECS transactions (20.07.2018)
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Journal Article
Scaling to Sub-1 nm Equivalent Oxide Thickness with Hafnium Oxide Deposited by Atomic Layer Deposition
Delabie, Annelies, Caymax, Matty, Brijs, Bert, Brunco, David P., Conard, Thierry, Sleeckx, Erik, Van Elshocht, Sven, Ragnarsson, Lars-Åke, De Gendt, Stefan, Heyns, Marc M.
Published in Journal of the Electrochemical Society (01.01.2006)
Published in Journal of the Electrochemical Society (01.01.2006)
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Journal Article
Highly efficient grating coupler between optical fiber and silicon photonic circuit
Selvaraja, S.K., Vermeulen, D., Schaekers, M., Sleeckx, E., Bogaerts, W., Roelkens, G., Dumon, P., Van Thourhout, D., Baets, R.
Published in 2009 Conference on Lasers and Electro-Optics and 2009 Conference on Quantum electronics and Laser Science Conference (01.05.2009)
Published in 2009 Conference on Lasers and Electro-Optics and 2009 Conference on Quantum electronics and Laser Science Conference (01.05.2009)
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Conference Proceeding
Enabling Ultra-Thin Die to Wafer Hybrid Bonding for Future Heterogeneous Integrated Systems
Phommahaxay, Alain, Suhard, Samuel, Bex, Pieter, Iacovo, Serena, Slabbekoorn, John, Inoue, Fumihiro, Peng, Lan, Kennes, Koen, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Atomic Layer Deposition of Ru and RuO 2 for MIMCAP Applications
Zhao, Chao, Pawlak, Malgorzata, Popovici, Mihaela I., Schaekers, Marc, Sleeckx, Erik, Vancoille, Eric, Wouters, Dirk, Tokei, Zsolt, Kittl, Jorge
Published in ECS transactions (25.09.2009)
Published in ECS transactions (25.09.2009)
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Journal Article
Advanced Dicing Technologies for Combination of Wafer to Wafer and Collective Die to Wafer Direct Bonding
Inoue, Fumihiro, Phommahaxay, Alain, Podpod, Arnita, Suhard, Samuel, Hoshino, Hitoshi, Moeller, Berthold, Sleeckx, Erik, June Rebibis, Kenneth, Miller, Andy, Beyne, Eric
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Characterization of Silicon Carbon Nitride for Low Temperature Wafer-to-Wafer Direct Bonding
Nagano, Fuya, Iacovo, Serena, Phommahaxay, Alain, Inoue, Fumihiro, Sleeckx, Erik, De Gendt, Stefan, Beyer, Gerald, Beyne, Eric
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
Published in Meeting abstracts (Electrochemical Society) (23.11.2020)
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Journal Article
Direct Bonding of low Temperature Heterogeneous Dielectrics
Iacovo, Serena, Peng, lan, Phommahaxay, Alain, Inoue, Fumihiro, Verdonck, Patrick, Kim, Soon-Wook, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Defect Identification in Bonding Surface Layers by Positron Annihilation Spectroscopy
Inoue, Fumihiro, Peng, Lan, Iacovo, Serena, Nagano, Fuya, Sleeckx, Erik, Beyer, Gerald, Uedono, Akira, Beyne, Eric
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
Published in 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) (01.05.2019)
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Conference Proceeding
Advances in Temporary Carrier Technology for High-Density Fan-Out Device Build-up
Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding
Thermal Compression Bonding: Understanding Heat Transfer by in Situ Measurements and Modeling
Bex, Pieter, Teng Wang, Lofrano, Melina, Cherman, Vladimir, Capuz, Giovanni, Sleeckx, Erik, Beyne, Eric
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up
Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Dongshun Bai, Arnold, Kim
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding