by Ostrowicki, G.T., Sitaraman, S.K.
Published in Thin solid films (30.03.2012)

by Tunga, K.R., Sitaraman, S.K.
Published in Experimental mechanics (01.06.2008)

by Shan, Zhaohui, Sitaraman, Suresh K
Published in Thin solid films (01.08.2003)

by Harries, R.J., Sitaraman, S.K.
Published in IEEE transactions on components and packaging technologies (01.06.2001)

by Modi, Mitul B., Sitaraman, Suresh K.
Published in Engineering fracture mechanics (01.06.2004)

by Ginga, Nicholas J., Chen, Wei, Sitaraman, Suresh K.
Published in Carbon (New York) (01.01.2014)

by Michaelides, S., Sitaraman, S.K.
Published in IEEE transactions on advanced packaging (01.11.1999)

by Xie, Weidong, Sitaraman, Suresh K
Published in Engineering fracture mechanics (01.06.2003)

by Pucha, Raghuram V, Ramakrishna, Gnyaneshwar, Mahalingam, Saketh, Sitaraman, Suresh K
Published in International journal of fatigue (01.09.2004)

by Sundararaman, V., Sitaraman, S.K.
Published in IEEE transactions on components and packaging technologies (01.06.2001)

by Zhu, Qi, Ma, Lunyu, Sitaraman, S K
Published in IEEE transactions on components and packaging technologies (01.09.2003)

by Dunne, R.C., Sitaraman, S.K.
Published in IEEE transactions on electronics packaging manufacturing (01.10.2002)

by Ahmad, M., Sitaraman, S.K.
Published in IEEE transactions on components and packaging technologies (01.06.2003)

by Sitaraman, S.K., Sundararaman, V., Manjula, S., Wong, C.P., Wu, J., Pike, R.T.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)

by Zhuqing Zhang, Sitaraman, S.K., Wong, C.P.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2004)

by Kacker, K., Sitaraman, S.K.
Published in Journal of microelectromechanical systems (01.04.2009)

by Ramakrishna, G., Fuhan Liu, Sitaraman, S.K.
Published in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (2002)

by Sitaraman, S.K., Raghunathan, R., Hanna, C.E.
Published in IEEE transactions on components and packaging technologies (01.09.2000)

by Dunne, R C, Sitaraman, S K, Luo, Shijian, Wong, C P, Estes, W E, Periyasamy, M, Coburn, J
Published in IEEE transactions on components and packaging technologies (01.09.2001)

by Qi Zhu, Lunyu Ma, Sitaraman, S.K.
Published in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (2002)