Cu/Low-k TBGA Glob Top Package Reliability Challenges
Lau Teck Beng, Siong Chin Teck, Chu-Chung Lee
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Challenges in Temperature Cycling Test for Electronic Packages Containing Low-K/Cu Silicon
Chu-Chung Lee, Tu Anh Tran, Yuan Yuan, Chin-Teck Siong, Lau, T.B.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Towards Higher Reliability Challenge of Au-Al intermetalic system
Yong Cheng Choi, Siong Chin Teck, Low Teck Poh, Ho Poh Hoon, Diong, S.
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Insulated Au-Flash PdCu wire processing and wire bond process robustness improvements for TBGA & LQFP packages
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Insulated PdCu wire bond challenges and resolution for HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Yow Kai Yun, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Challenges and resolution of insulated PdCu wire bond for TBGA HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Conference Proceeding
Challenges in cavity-down thermally enhanced packages containing low-k die
Chu-Chung Lee, Tu Anh Tran, Yuan Yuan, Chin Teck Siong
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding
Laser grooving process development for low-k / ultra low-k devices
Lau Teck Beng, Yew, Calvin Lo Wai, Koh Wen Shi, Siong Chin Teck, Yow, K Y
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
2N Au wire bonding for ultra fine picth BGA
Eu Poh Leng, Yong, C.C., Chin Teck Siong, Masahiro, T., Vo, N., Lee Boon Seong, Faizal, Z.-K.M., Sazilawati, F.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
SEMICONDUCTOR PACKAGES WITH WIRING ON RE-DISTRIBUTED BUMPS
Huang, Wen Hung, Mao, Kuan-Hsiang, Lo, Tsung Nan, Mohd Sukemi, Norazham, Siong, Chin Teck
Year of Publication 07.02.2024
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Year of Publication 07.02.2024
Patent
SEMICONDUCTOR PACKAGES WITH WIRING ON RE-DISTRIBUTED BUMPS
Huang, Wen Hung, Mao, Kuan-Hsiang, Lo, Tsung Nan, Mohd Sukemi, Norazham, Siong, Chin Teck
Year of Publication 01.11.2023
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Year of Publication 01.11.2023
Patent
SEMICONDUCTOR PACKAGES WITH EMBEDDED WIRING ON RE-DISTRIBUTED BUMPS
Huang, Wen Hung, Mao, Kuan-Hsiang, Lo, Tsung Nan, Mohd Sukemi, Norazham, Siong, Chin Teck
Year of Publication 26.10.2023
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Year of Publication 26.10.2023
Patent
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR
Huang, Wen Hung, Mao, Kuan-Hsiang, Hiew, Pey Fang, Tay, Sharon Huey Lin, Chuang, Wen Yuan, Siong, Chin Teck
Year of Publication 11.01.2024
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Year of Publication 11.01.2024
Patent
SEMICONDUCTOR DEVICE WITH LEAD-ON-CHIP INTERCONNECT AND METHOD THEREFOR
Huang, Wen Hung, Mao, Kuan-Hsiang, Hiew, Pey Fang, Tay, Sharon Huey Lin, Chuang, Wen Yuan, Siong, Chin Teck
Year of Publication 10.01.2024
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Year of Publication 10.01.2024
Patent
Semiconductor device with bond wire reinforcement structure
Low, Boon Yew, Lo, Wai Yew, Tan, Lan Chu, Eu, Poh Leng, Siong, Chin Teck
Year of Publication 06.07.2021
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Year of Publication 06.07.2021
Patent