Water-tolerant enantioselective carbonyl-ene reactions with palladium(II) and platinum(II) Lewis acid catalysts bearing BINAP
Luo, He-Kuan, Yang, Hai-Yan, Jie, Tan Xiang, Chiew, Ong Siong, Schumann, Herbert, Khim, Lim Bee, Lim, Christina
Published in Journal of molecular catalysis. A, Chemical (02.01.2007)
Published in Journal of molecular catalysis. A, Chemical (02.01.2007)
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Journal Article
Embedded Wafer Level Packaging for 77-GHz Automotive Radar Front-End With Through Silicon Via and its 3-D Integration
Li, Rui, Jin, Cheng, Ong, Siong Chiew, Lim, Teck Guan, Chang, Ka Fai, Ho, Soon Wee
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2013)
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Journal Article
Low-Stress Bond Pad Design for Low-Temperature Solder Interconnections on Through-Silicon Vias (TSVs)
Xiaowu Zhang, Rajoo, R, Selvanayagam, C S, Premachandran, C S, Won Kyoung Choi, Soon Wee Ho, Siong Chiew Ong, Ling Xie, Pinjala, D, Dim-Lee Kwong, Yee Mong Khoo, Shan Gao
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2011)
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Journal Article
Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking
Ling Xie, Won Kyoung Choi, Premachandran, C. S., Selvanayagam, C. S., Ke Wu Bai, Ying Zhi Zeng, Siong Chiew Ong, Ebin Liao, Khairyanto, A., Sekhar, V. N., Thew, S.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Three chips stacking with low volume solder using single re-flow process
Khan, Navas, Wee, David Ho Soon, Ong Siong Chiew, Sharmani, Cheryl, Li Shiah Lim, Hong Yu Li, Vasarala, Shekar
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
A 135GHz slotline bandpass filter using silicon/membrane technology
Rui Li, Cheng Jin, Sampath, K. P., Min Tang, Soon Wee Ho, Siong Chiew Ong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
A novel die to wafer (D2W) collective bonding method for MEMS and electronics heterogeneous 3D integration
Won Kyoung Choi, Premachandran, C S, Ling Xie, Siong Chiew Ong, He, Johnny Han, Guan Jie Yap, Aibin Yu
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)
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Conference Proceeding
Development of Copper Via Exposure by two steps process
Chiew, Joe Ong Siong, Sheng, Vincent Lee Wen, Gao Shan
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Thin die stacking by low temperature In/ Au IMC based bonding method
Ong, Siong Chiew, Choi, Won Kyoung, Premachandran, C. S., Liao, Ebin, Xie, Ling
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Development of thin film dielectric embedded 3D stacked package
Ho, Soon Wee, Su, Nandar, Lim, Li Shiah, Ong, Siong Chiew, Lee, Wen Sheng, Rao, Vempati Srinivasa
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
Choi, W.K., Premachandran, C.S., Chiew, O.S., Ling, X., Ebin, L., Khairyanto, A., Ratmin, B., Sheng, K.C.W., Thaw, P.P., Lau, J.H.
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
C2W bonding method for MEMS applications
Kelvin, Chen Wei Sheng, Premachandran, C.S., Kyoung, Choi Won, Ling, Ong Siong Chiew Xie, Ratmin, Ahmad Khairyanto Bin, Pa, Myo Ei Pa, Lau, John
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Method of Forming a Bonded Structure
ONG SIONG CHIEW JOE, CHOI WON KYOUNG, XIE LING, BAI KEWU, PREMACHANDRAN CHIRAHARIKATHU VEEDU SANKARAPILLAI, LIAO EBIN
Year of Publication 14.02.2013
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Year of Publication 14.02.2013
Patent
METHOD OF STACKING CHIPS
KHAN, ORATTI, KALANDAR, NAVAS, HO, SOON WEE, SELVANAGAM, CHERYL, SHARMANI, ONG, SIONG CHIEW, JOE
Year of Publication 01.09.2011
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Year of Publication 01.09.2011
Patent
A METHOD OF FORMING A BONDED STRUCTURE
PREMACHANDRAN, CHIRAHARIKATHU VEEDU SANKARAPILLAI, XIE, LING, BAI, KEWU, ONG, SIONG CHIEW JOE, CHOI, WON KYOUNG, LIAO, EBIN
Year of Publication 27.09.2012
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Year of Publication 27.09.2012
Patent
A METHOD OF FORMING A BONDED STRUCTURE
PREMACHANDRAN, CHIRAHARIKATHU VEEDU SANKARAPILLAI, XIE, LING, BAI, KEWU, ONG, SIONG CHIEW JOE, CHOI, WON KYOUNG, LIAO, EBIN
Year of Publication 18.08.2011
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Year of Publication 18.08.2011
Patent