Stress evolution in the metal layers of TSVs with Bosch scallops
Singulani, A.P., Ceric, H., Selberherr, S.
Published in Microelectronics and reliability (01.09.2013)
Published in Microelectronics and reliability (01.09.2013)
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Journal Article
Conference Proceeding
Impact of across-wafer variation on the electrical performance of TSVs
Filipovic, L., Selberherr, S., Singulani, A. P., Roger, F., Carniello, S.
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
Published in 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) (01.05.2016)
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Conference Proceeding
Journal Article
Stress estimation in open tungsten TSV
Singulani, A. P., Ceric, H., Selberherr, S.
Published in 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2013)
Published in 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (01.09.2013)
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Conference Proceeding
Effects of Bosch scallops on metal layer stress of an open Through Silicon Via technology
Singulani, A. P., Ceric, H., Langer, E., Carniello, S.
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
Published in 2013 IEEE International Reliability Physics Symposium (IRPS) (01.04.2013)
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Conference Proceeding
Modelling and characterization of a microhotplate
Singulani, A. P., Toschkoff, G., Sagmeister, M., Carniello, S.
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
Published in 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2018)
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Conference Proceeding
A Computer Based Optimization Method for Quantum Dots Growth
Singulani, Anderson, Vilela Neto, Omar P., Pacheco, Marco Aurélio C., Pires, Mauricio P., Souza, Patricia L.
Published in ECS transactions (22.08.2008)
Published in ECS transactions (22.08.2008)
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Journal Article
Stress evolution on tungsten thin-film of an open through silicon via technology
Singulani, A. P., Ceric, H., Langer, E.
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding
Stress reduction induced by Bosch scallops on an open TSV technology
Singulani, A. P., Ceric, H., Langer, E.
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
Impact of bosch scallops dimensions on stress of an open through Silicon Via technology
Singulani, A. P., Ceric, H., Filipovic, L., Langer, E.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
Thermo-mechanical simulations of an open tungsten TSV
Singulani, A. P., Ceric, H., Selberherr, S.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
LU Decomposition on GPUs: The Impact of Memory Access
Cupertino, L F, Singulani, A P, da Silva, C P, Pacheco, M A C, Farias, R
Published in 2010 22nd International Symposium on Computer Architecture and High Performance Computing Workshops (01.10.2010)
Published in 2010 22nd International Symposium on Computer Architecture and High Performance Computing Workshops (01.10.2010)
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Conference Proceeding
Through Silicon Via Reliability
Cassidy, C., Kraft, J., Carniello, S., Roger, F., Ceric, H., Singulani, A. P., Langer, E., Schrank, F.
Published in IEEE transactions on device and materials reliability (01.06.2012)
Published in IEEE transactions on device and materials reliability (01.06.2012)
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Magazine Article